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1. 
Cover image for Piezoceramic Sensors
Piezoceramic Sensors
Author 
Sharapov, Valeriy. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-3-642-15311-2
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2. 
Cover image for Thermal Transport for Applications in Micro/Nanomachining
Thermal Transport for Applications in Micro/Nanomachining
Author 
Wong, Basil T. author. Mengüç, M. Pinar. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-3-540-73607-3
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3. 
Cover image for Capillary Forces in Microassembly Modeling, Simulation, Experiments, and Case Study
Capillary Forces in Microassembly Modeling, Simulation, Experiments, and Case Study
Author 
Lambert, Pierre. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-0-387-71089-1
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4. 
Cover image for Integrated Chemical Microsensor Systems in CMOS Technology
Integrated Chemical Microsensor Systems in CMOS Technology
Author 
Hierlemann, Andreas. author. Baltes, H. editor. Fujita, Hiroyuki. editor. Liepmann, Dorian. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/b138987
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5. 
Cover image for CCD Image Sensors in Deep-Ultraviolet Degradation Behavior and Damage Mechanisms
CCD Image Sensors in Deep-Ultraviolet Degradation Behavior and Damage Mechanisms
Author 
Li, Flora M. author. Nathan, Arokia. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/b139047
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6. 
Cover image for Force Sensors for Microelectronic Packaging Applications
Force Sensors for Microelectronic Packaging Applications
Author 
Schwizer, Jürg. author. Mayer, Michael. author. Brand, Oliver. author. SpringerLink (Online service)
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Electronic Access 
http://dx.doi.org/10.1007/b138345
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