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1. 
Cover image for Science and Technology of Semiconductor-On-Insulator Structures and Devices Operating in a Harsh Environment Proceedings of the NATO Advanced Research Workshop on Science and Technology of Semiconductor-On-Insulator Structures and Devices Operating in a Harsh Environment Kiev, Ukraine 26–30 April 2004
Science and Technology of Semiconductor-On-Insulator Structures and Devices Operating in a Harsh Environment Proceedings of the NATO Advanced Research Workshop on Science and Technology of Semiconductor-On-Insulator Structures and Devices Operating in a Harsh Environment Kiev, Ukraine 26–30 April 2004
Author 
Flandre, Denis. editor. Nazarov, Alexei N. editor. Hemment, Peter L.F. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1007/1-4020-3013-4
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2. 
Cover image for Applications of Organic and Printed Electronics A Technology-Enabled Revolution
Applications of Organic and Printed Electronics A Technology-Enabled Revolution
Author 
Cantatore, Eugenio. editor. SpringerLink (Online service)
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ONLINE(331320.1)
Electronic Access 
http://dx.doi.org/10.1007/978-1-4614-3160-2
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3. 
Cover image for Physical Properties of Nanorods
Physical Properties of Nanorods
Author 
Krahne, Roman. author. Manna, Liberato. author. Morello, Giovanni. author. Figuerola, Albert. author. George, Chandramohan. author.
Preferred Shelf Number 
ONLINE(334202.1)
Electronic Access 
http://dx.doi.org/10.1007/978-3-642-36430-3
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4. 
Cover image for Photoelectrochemical Hydrogen Production
Photoelectrochemical Hydrogen Production
Author 
van de Krol, Roel. editor. Grätzel, Michael. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-1-4614-1380-6
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5. 
Cover image for Metal-Dielectric Interfaces in Gigascale Electronics Thermal and Electrical Stability
Metal-Dielectric Interfaces in Gigascale Electronics Thermal and Electrical Stability
Author 
He, Ming. author. Lu, Toh-Ming. author. SpringerLink (Online service)
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ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-1-4614-1812-2
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6. 
Cover image for Nanostructured Materials for Engineering Applications
Nanostructured Materials for Engineering Applications
Author 
Bergmann, Carlos Pérez. editor. Andrade, Mônica Jung. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-3-642-19131-2
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7. 
Cover image for Handbook of Transparent Conductors
Handbook of Transparent Conductors
Author 
Ginley, David S. editor. SpringerLink (Online service)
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ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-1-4419-1638-9
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8. 
Cover image for Lithium Niobate Defects, Photorefraction and Ferroelectric Switching
Lithium Niobate Defects, Photorefraction and Ferroelectric Switching
Author 
Volk, Tatyana. author. Wöhlecke, Manfred. author. SpringerLink (Online service)
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ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-3-540-70766-0
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9. 
Cover image for Energy Harvesting Technologies
Energy Harvesting Technologies
Author 
Priya, Shashank. editor. Inman, Daniel J. editor. SpringerLink (Online service)
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ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-0-387-76464-1
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10. 
Cover image for Organic Field Effect Transistors Theory, Fabrication and Characterization
Organic Field Effect Transistors Theory, Fabrication and Characterization
Author 
Kymissis, Ioannis. author. SpringerLink (Online service)
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ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-0-387-92134-1
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11. 
Cover image for Organic Nanostructures for Next Generation Devices
Organic Nanostructures for Next Generation Devices
Author 
Al-Shamery, Katharina. editor. Rubahn, Horst-Günter. editor. Sitter, Helmut. editor. SpringerLink (Online service)
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ONLINE
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http://dx.doi.org/10.1007/978-3-540-71923-6
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12. 
Cover image for Dilute III-V Nitride Semiconductors and Material Systems Physics and Technology
Dilute III-V Nitride Semiconductors and Material Systems Physics and Technology
Author 
Erol, Ayşe. editor. SpringerLink (Online service)
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ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-3-540-74529-7
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