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1. 
Cover image for Electroceramic-Based MEMS Fabrication-Technology and Applications
Electroceramic-Based MEMS Fabrication-Technology and Applications
Author 
Setter, Nava. editor. SpringerLink (Online service)
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ONLINE
Electronic Access 
http://dx.doi.org/10.1007/b101200
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2. 
Cover image for Nanotechnology and Nanoelectronics Materials, Devices, Measurement Techniques
Nanotechnology and Nanoelectronics Materials, Devices, Measurement Techniques
Author 
Fahrner, W. R. editor. SpringerLink (Online service)
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ONLINE
Electronic Access 
http://dx.doi.org/10.1007/b137771
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3. 
Cover image for Force Sensors for Microelectronic Packaging Applications
Force Sensors for Microelectronic Packaging Applications
Author 
Schwizer, Jürg. author. Mayer, Michael. author. Brand, Oliver. author. SpringerLink (Online service)
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ONLINE
Electronic Access 
http://dx.doi.org/10.1007/b138345
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4. 
Cover image for Integrated Chemical Microsensor Systems in CMOS Technology
Integrated Chemical Microsensor Systems in CMOS Technology
Author 
Hierlemann, Andreas. author. Baltes, H. editor. Fujita, Hiroyuki. editor. Liepmann, Dorian. editor. SpringerLink (Online service)
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ONLINE
Electronic Access 
http://dx.doi.org/10.1007/b138987
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5. 
Cover image for Silicon Quantum Integrated Circuits Silicon-Germanium Heterostructure Devices: Basics and Realisations
Silicon Quantum Integrated Circuits Silicon-Germanium Heterostructure Devices: Basics and Realisations
Author 
Kasper, Erich. author. Paul, D.J. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1007/b137494
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6. 
Cover image for Ambient Intelligence
Ambient Intelligence
Author 
Weber, Werner. editor. Rabaey, Jan M. editor. Aarts, Emile. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1007/b138670
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