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1. 
Cover image for Materials Chemistry
Materials Chemistry
Author 
Fahlman, Bradley D. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-1-4020-6120-2
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2. 
Cover image for Solder Joint Technology Materials, Properties, and Reliability
Solder Joint Technology Materials, Properties, and Reliability
Author 
Tu, King-Ning. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-0-387-38892-2
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3. 
Cover image for Nanocomposites Ionic Conducting Materials and Structural Spectroscopies
Nanocomposites Ionic Conducting Materials and Structural Spectroscopies
Author 
Knauth, Philippe. editor. Schoonman, Joop. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-0-387-68907-4
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4. 
Cover image for Plasmonics: Fundamentals and Applications
Plasmonics: Fundamentals and Applications
Author 
Maier, Stefan A. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1007/0-387-37825-1
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5. 
Cover image for Ceramic Materials Science and Engineering
Ceramic Materials Science and Engineering
Author 
Carter, C. Barry. author. Norton, M. Grant. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-0-387-46271-4
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