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1. 
Cover image for Multilayered Low Temperature Cofired Ceramics (LTCC) Technology
Multilayered Low Temperature Cofired Ceramics (LTCC) Technology
Author 
Imanaka, Yoshihiko. author. SpringerLink (Online service)
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ONLINE
Electronic Access 
http://dx.doi.org/10.1007/b101196
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2. 
Cover image for Electroceramic-Based MEMS Fabrication-Technology and Applications
Electroceramic-Based MEMS Fabrication-Technology and Applications
Author 
Setter, Nava. editor. SpringerLink (Online service)
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ONLINE
Electronic Access 
http://dx.doi.org/10.1007/b101200
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3. 
Cover image for Modern Techniques for Characterizing Magnetic Materials
Modern Techniques for Characterizing Magnetic Materials
Author 
Zhu, Yimei. editor. SpringerLink (Online service)
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ONLINE
Electronic Access 
http://dx.doi.org/10.1007/b101202
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4. 
Cover image for Physik der Halbleiterbauelemente Einführendes Lehrbuch für Ingenieure und Physiker
Physik der Halbleiterbauelemente Einführendes Lehrbuch für Ingenieure und Physiker
Author 
Thuselt, Frank. author. SpringerLink (Online service)
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Electronic Access 
http://dx.doi.org/10.1007/b138004
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5. 
Cover image for Force Sensors for Microelectronic Packaging Applications
Force Sensors for Microelectronic Packaging Applications
Author 
Schwizer, Jürg. author. Mayer, Michael. author. Brand, Oliver. author. SpringerLink (Online service)
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ONLINE
Electronic Access 
http://dx.doi.org/10.1007/b138345
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6. 
Cover image for Ultrathin Magnetic Structures I An Introduction to the Electronic, Magnetic and Structural Properties
Ultrathin Magnetic Structures I An Introduction to the Electronic, Magnetic and Structural Properties
Author 
Bland, J. Anthony C. Heinrich, Bretislav. SpringerLink (Online service)
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Electronic Access 
http://dx.doi.org/10.1007/b138789
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7. 
Cover image for Integrated Chemical Microsensor Systems in CMOS Technology
Integrated Chemical Microsensor Systems in CMOS Technology
Author 
Hierlemann, Andreas. author. Baltes, H. editor. Fujita, Hiroyuki. editor. Liepmann, Dorian. editor. SpringerLink (Online service)
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ONLINE
Electronic Access 
http://dx.doi.org/10.1007/b138987
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8. 
Cover image for CCD Image Sensors in Deep-Ultraviolet Degradation Behavior and Damage Mechanisms
CCD Image Sensors in Deep-Ultraviolet Degradation Behavior and Damage Mechanisms
Author 
Li, Flora M. author. Nathan, Arokia. author. SpringerLink (Online service)
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Electronic Access 
http://dx.doi.org/10.1007/b139047
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9. 
Cover image for Thin Films and Heterostructures for Oxide Electronics
Thin Films and Heterostructures for Oxide Electronics
Author 
Ogale, Satischandra B. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/b136780
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10. 
Cover image for Silicon Quantum Integrated Circuits Silicon-Germanium Heterostructure Devices: Basics and Realisations
Silicon Quantum Integrated Circuits Silicon-Germanium Heterostructure Devices: Basics and Realisations
Author 
Kasper, Erich. author. Paul, D.J. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/b137494
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11. 
Cover image for Fundamentals of Semiconductors Physics and Materials Properties
Fundamentals of Semiconductors Physics and Materials Properties
Author 
Yu, Peter Y. Cardona, Manuel. SpringerLink (Online service)
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http://dx.doi.org/10.1007/b137661
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12. 
Cover image for Shape and Functional Elements of the Bulk Silicon Microtechnique A Manual of Wet-Etched Silicon Structures
Shape and Functional Elements of the Bulk Silicon Microtechnique A Manual of Wet-Etched Silicon Structures
Author 
Frühauf, Joachim. author. SpringerLink (Online service)
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Electronic Access 
http://dx.doi.org/10.1007/b138230
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