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1. 
Cover image for Data Converters
Data Converters
Author 
Maloberti, Franco. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-0-387-32486-9
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2. 
Cover image for Integrated Circuit Packaging, Assembly and Interconnections
Integrated Circuit Packaging, Assembly and Interconnections
Author 
Greig, William J. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/0-387-33913-2
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3. 
Cover image for Piezoelectric Multilayer Beam Bending Actuators Static and Dynamic Behavior and Aspects of Sensor Integration
Piezoelectric Multilayer Beam Bending Actuators Static and Dynamic Behavior and Aspects of Sensor Integration
Author 
Ballas, Rüdiger G. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-3-540-32642-7
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4. 
Cover image for A Guide to Lead-free Solders Physical Metallurgy and Reliability
A Guide to Lead-free Solders Physical Metallurgy and Reliability
Author 
Evans, John W. author. Engelmaier, Werner. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-1-84628-310-9
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5. 
Cover image for Electroactive Polymers for Robotic Applications Artificial Muscles and Sensors
Electroactive Polymers for Robotic Applications Artificial Muscles and Sensors
Author 
Kim, Kwang J. editor. Tadokoro, Satoshi. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-1-84628-372-7
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6. 
Cover image for Simulation of Semiconductor Processes and Devices 2007 SISPAD 2007
Simulation of Semiconductor Processes and Devices 2007 SISPAD 2007
Author 
Grasser, Tibor. editor. Selberherr, Siegfried. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-3-211-72861-1
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7. 
Cover image for CMOS Hotplate Chemical Microsensors
CMOS Hotplate Chemical Microsensors
Author 
Graf, Markus. author. Barrettino, Diego. author. Baltes, Henry P. author. Hierlemann, Andreas. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-3-540-69562-2
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8. 
Cover image for Physics of Negative Refraction and Negative Index Materials Optical and Electronic Aspects and Diversified Approaches
Physics of Negative Refraction and Negative Index Materials Optical and Electronic Aspects and Diversified Approaches
Author 
Krowne, Clifford M. editor. Zhang, Yong. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-3-540-72132-1
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9. 
Cover image for Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging
Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging
Author 
Suhir, E. editor. Lee, Y. C. editor. Wong, C. P. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/0-387-32989-7
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10. 
Cover image for Lead-Free Electronic Solders A Special Issue of the Journal of Materials Science: Materials in Electronics
Lead-Free Electronic Solders A Special Issue of the Journal of Materials Science: Materials in Electronics
Author 
Subramanian, K. N. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-0-387-48433-4
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11. 
Cover image for Lead-Free Soldering
Lead-Free Soldering
Author 
Bath, Jasbir. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-0-387-68422-2
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