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1. 
Cover image for Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging
Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging
Author 
Suhir, E. editor. Lee, Y. C. editor. Wong, C. P. editor. SpringerLink (Online service)
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ONLINE
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http://dx.doi.org/10.1007/0-387-32989-7
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2. 
Cover image for Solder Joint Technology Materials, Properties, and Reliability
Solder Joint Technology Materials, Properties, and Reliability
Author 
Tu, King-Ning. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-0-387-38892-2
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3. 
Cover image for Process Optimization A Statistical Approach
Process Optimization A Statistical Approach
Author 
Castillo, Enrique Del. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-0-387-71435-6
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4. 
Cover image for Supply Chain Games: Operations Management And Risk Valuation
Supply Chain Games: Operations Management And Risk Valuation
Author 
Kogan, Konstantin. author. Tapiero, Charles S. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-0-387-72776-9
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5. 
Cover image for Kent and Riegel’s Handbook of Industrial Chemistry and Biotechnology
Kent and Riegel’s Handbook of Industrial Chemistry and Biotechnology
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Kent, James A. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-0-387-27843-8
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6. 
Cover image for Lead-Free Electronic Solders A Special Issue of the Journal of Materials Science: Materials in Electronics
Lead-Free Electronic Solders A Special Issue of the Journal of Materials Science: Materials in Electronics
Author 
Subramanian, K. N. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-0-387-48433-4
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7. 
Cover image for Reliability, Life Testing and the Prediction of Service Lives For Engineers and Scientists
Reliability, Life Testing and the Prediction of Service Lives For Engineers and Scientists
Author 
Saunders, Sam C. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-0-387-48538-6
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8. 
Cover image for Ultrasonic Nondestructive Evaluation Systems Models and Measurements
Ultrasonic Nondestructive Evaluation Systems Models and Measurements
Author 
Schmerr, Lester W. author. Song, Sung-Jin. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-0-387-49063-2
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9. 
Cover image for Life Distributions Structure of Nonparametric, Semiparametric, and Parametric Families
Life Distributions Structure of Nonparametric, Semiparametric, and Parametric Families
Author 
Marshall, Albert W. author. Olkin, Ingram. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-0-387-68477-2
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10. 
Cover image for The Statistical Analysis of Recurrent Events
The Statistical Analysis of Recurrent Events
Author 
Cook, Richard J. author. Lawless, Jerald F. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-0-387-69810-6
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11. 
Cover image for Metal Fatigue What It Is, Why It Matters
Metal Fatigue What It Is, Why It Matters
Author 
Pook, Les. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-1-4020-5597-3
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12. 
Cover image for The Winning Line A Forensic Engineer’s Casebook
The Winning Line A Forensic Engineer’s Casebook
Author 
Samuel, Andrew. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-1-84628-097-9
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