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Cover image for Power Electronic Packaging Design, Assembly Process, Reliability and Modeling
Power Electronic Packaging Design, Assembly Process, Reliability and Modeling
Author 
Liu, Yong. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-1-4614-1053-9
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2. 
Cover image for Computational Intelligence and Intelligent Systems 6th International Symposium, ISICA 2012, Wuhan, China, October 27-28, 2012. Proceedings
Computational Intelligence and Intelligent Systems 6th International Symposium, ISICA 2012, Wuhan, China, October 27-28, 2012. Proceedings
Author 
Li, Zhenhua. editor. Li, Xiang. editor. Liu, Yong. editor. Cai, Zhihua. editor. SpringerLink (Online service)
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Electronic Access 
http://dx.doi.org/10.1007/978-3-642-34289-9
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3. 
Cover image for Handbook of innovative nanomaterials from syntheses to applications
Handbook of innovative nanomaterials from syntheses to applications
Author 
Fang, Xiaosheng. Wu, Limin.
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ONLINE
Electronic Access 
Distributed by publisher. Purchase or institutional license may be required for access.
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