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1. 
Cover image for Copper Wire Bonding
Copper Wire Bonding
Author 
Chauhan, Preeti S. author. Choubey, Anupam. author. Zhong, ZhaoWei. author. Pecht, Michael G. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-1-4614-5761-9
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2. 
Cover image for Electrons and chemical bonding
Electrons and chemical bonding
Author 
Gray, Harry B.
Preferred Shelf Number 
QD 461 G72 1964
Format: 
Availability 
Beytepe Library~1
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3. 
Cover image for Interatomic bonding in solids fundamentals, simulation, applications
Interatomic bonding in solids fundamentals, simulation, applications
Author 
Levitin, Valim.
Preferred Shelf Number 
ONLINE(342212.1)
Electronic Access 
John Wiley http://dx.doi.org/10.1002/9783527671557
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4. 
Cover image for Handbook of adhesives and sealants. Volume 1, Adhesives and sealants basic concepts and high tech bonding
Handbook of adhesives and sealants. Volume 1, Adhesives and sealants basic concepts and high tech bonding
Author 
Cognard, Philippe.
Preferred Shelf Number 
ONLINE
Electronic Access 
ScienceDirect http://www.sciencedirect.com/science/book/9780080445540
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5. 
Cover image for The basics of organic chemistry
The basics of organic chemistry
Author 
Clowes, Martin, author.
Preferred Shelf Number 
QD251.3 C56 2014
Format: 
Availability 
Beytepe Library~1
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6. 
Cover image for Gas insulated substations
Gas insulated substations
Author 
Koch, Hermann, 1954- editor.
Preferred Shelf Number 
ONLINE(341674.1)
Electronic Access 
ebrary An electronic book accessible through the World Wide Web; click to view
John Wiley http://dx.doi.org/10.1002/9781118694534
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