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International Symposium on Polyimides and other High Temperature Polymers.
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Bar-Cohen, Yoseph, editor.
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Chu, Paul K.
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Heat resistant materials -- Congresses.
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Polyimides -- Congresses.
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Polyimides -- Industrial applications -- Congresses.
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1. 
Cover image for High temperature oxides
High temperature oxides
Author 
M. Alper, Allen, ed.
Preferred Shelf Number 
TN 677 H54 1970-1971 V.1
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Beytepe Library~4
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2. 
Cover image for High temperature polymer blends
High temperature polymer blends
Author 
DeMeuse, Mark T., editor.
Preferred Shelf Number 
ONLINE(355876.1)
Electronic Access 
ScienceDirect http://www.sciencedirect.com/science/book/9781845697853
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3. 
Cover image for Temperature and plant development
Temperature and plant development
Author 
Franklin, Keara A., editor. Wigge, Philip A., editor.
Preferred Shelf Number 
ONLINE(341500.1)
Electronic Access 
Connect to full text
John Wiley http://dx.doi.org/10.1002/9781118308240
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4. 
Cover image for Progress in low temperature physics
Progress in low temperature physics
Author 
Gorter, Cornelis Jacobus, 1907-
Preferred Shelf Number 
ONLINE
Electronic Access 
ScienceDirect http://www.sciencedirect.com/science/book/9780444872739
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5. 
Cover image for Progress in low temperature physics
Progress in low temperature physics
Author 
Gorter, Cornelis Jacobus, 1907- ed.
Preferred Shelf Number 
QC 278 G6 1955- V.4
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6. 
Cover image for High temperature materials and mechanisms
High temperature materials and mechanisms
Author 
Bar-Cohen, Yoseph, editor.
Preferred Shelf Number 
ONLINE(356356.1)
Electronic Access 
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7. 
Cover image for Environmental and low temperature geochemistry
Environmental and low temperature geochemistry
Author 
Ryan, Peter, 1966- author.
Preferred Shelf Number 
QE516.4 R93 2014
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8. 
Cover image for 5th International Symposium on High Temperature Metallurgical Processing proceedings of a symposium sponsored by the Minerals, Metals & Materials Society (TMS) held during TMS 2014, 143rd Annual Meeting & Exhibition, San Diego Convention Center, San Diego, California, USA
5th International Symposium on High Temperature Metallurgical Processing proceedings of a symposium sponsored by the Minerals, Metals & Materials Society (TMS) held during TMS 2014, 143rd Annual Meeting & Exhibition, San Diego Convention Center, San Diego, California, USA
Author 
International Symposium on High-Temperature Metallurgical Processing (5th : 2014 : San Diego, Calif.) Jiang, Tao.
Preferred Shelf Number 
ONLINE(341952.1)
Electronic Access 
Ebook Library http://public.eblib.com/choice/publicfullrecord.aspx?p=1605599
ebrary http://site.ebrary.com/id/10833793
John Wiley http://dx.doi.org/10.1002/9781118887998
MyiLibrary http://www.myilibrary.com?id=572493
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9. 
Cover image for High Temperature Ceramic Matrix Composites 8 : a collection of papers presented at the HTCMC-8 Conference, September 22-26, 2013, Xi'an, Shaanxi, China
High Temperature Ceramic Matrix Composites 8 : a collection of papers presented at the HTCMC-8 Conference, September 22-26, 2013, Xi'an, Shaanxi, China
Author 
International Conference on High-Temperature Ceramic-Matrix Composites (8th : 2013 : Xi'an, Shaanxi Sheng, China) Zhang, Litong, editor. Jiang, Dongliang, 1937- editor.
Preferred Shelf Number 
ONLINE(342058.1)
Electronic Access 
Wiley Available through Wiley Online Library
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10. 
Cover image for Low temperature plasma technology methods and applications
Low temperature plasma technology methods and applications
Author 
Chu, Paul K.
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ONLINE
Electronic Access 
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11. 
Cover image for Bias Temperature Instability for Devices and Circuits
Bias Temperature Instability for Devices and Circuits
Author 
Grasser, Tibor. editor. SpringerLink (Online service)
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ONLINE
Electronic Access 
https://doi.org/10.1007/978-1-4614-7909-3
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12. 
Cover image for Polyimides and other high temperature polymers synthesis, characterization and applications.
Polyimides and other high temperature polymers synthesis, characterization and applications.
Author 
International Symposium on Polyimides and other High Temperature Polymers.
Preferred Shelf Number 
ONLINE
Electronic Access 
Distributed by publisher. Purchase or institutional license may be required for access.
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