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1. 
Cover image for MEMS Materials and Processes Handbook
MEMS Materials and Processes Handbook
Author 
Ghodssi, Reza. editor. Lin, Pinyen. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-0-387-47318-5
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2. 
Cover image for The ELFNET Book on Failure Mechanisms, Testing Methods, and Quality Issues of Lead-Free Solder Interconnects
The ELFNET Book on Failure Mechanisms, Testing Methods, and Quality Issues of Lead-Free Solder Interconnects
Author 
Grossmann, Günter. editor. Zardini, Christian. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-0-85729-236-0
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3. 
Cover image for Introductory MEMS Fabrication and Applications
Introductory MEMS Fabrication and Applications
Author 
Adams, Thomas M. author. Layton, Richard A. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-0-387-09511-0
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4. 
Cover image for Three Dimensional Integrated Circuit Design EDA, Design and Microarchitectures
Three Dimensional Integrated Circuit Design EDA, Design and Microarchitectures
Author 
Xie, Yuan. editor. Cong, Jason. editor. Sapatnekar, Sachin. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-1-4419-0784-4
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5. 
Cover image for Sapphire Material, Manufacturing, Applications
Sapphire Material, Manufacturing, Applications
Author 
Pishchik, Valerian. author. Lytvynov, Leonid A. author. Dobrovinskaya, Elena R. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-0-387-85695-7
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6. 
Cover image for Wafer Level 3-D ICs Process Technology
Wafer Level 3-D ICs Process Technology
Author 
Tan, Chuan Seng. editor. Gutmann, Ronald J. editor. Reif, L. Rafael. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-0-387-76534-1
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7. 
Cover image for Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging
Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging
Author 
Suhir, E. editor. Lee, Y. C. editor. Wong, C. P. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1007/0-387-32989-7
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8. 
Cover image for Micromachined Thin-Film Sensors for SOI-CMOS Co-Integration
Micromachined Thin-Film Sensors for SOI-CMOS Co-Integration
Author 
Laconte, J. author. Flandre, D. author. Raskin, J. -P. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1007/0-387-28843-0
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9. 
Cover image for Materials for Information Technology Devices, Interconnects and Packaging
Materials for Information Technology Devices, Interconnects and Packaging
Author 
Zschech, Ehrenfried. editor. Whelan, Caroline. editor. Mikolajick, Thomas. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1007/1-84628-235-7
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