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1. 
Cover image for Analysis and Simulation of Electrical and Computer Systems
Analysis and Simulation of Electrical and Computer Systems
Author 
Mazur, Damian. editor. Gołębiowski, Marek. editor. Korkosz, Mariusz. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-63949-9
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2. 
Cover image for Analysis and Simulation of Electrical and Computer Systems
Analysis and Simulation of Electrical and Computer Systems
Author 
Gołębiowski, Lesław. editor. Mazur, Damian. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-11248-0
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3. 
Cover image for Modeling and Application of Flexible Electronics Packaging
Modeling and Application of Flexible Electronics Packaging
Author 
Huang, YongAn. author. Yin, Zhouping. author. Wan, Xiaodong. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-981-13-3627-0
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4. 
Cover image for Future Information Technology - II
Future Information Technology - II
Author 
Park, James J. (Jong Hyuk). editor. Pan, Yi. editor. Kim, Cheonshik. editor. Yang, Yun. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-94-017-9558-6
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5. 
Cover image for Advancements of Medical Electronics Proceedings of the First International Conference, ICAME 2015
Advancements of Medical Electronics Proceedings of the First International Conference, ICAME 2015
Author 
Gupta, Somsubhra. editor. Bag, Sandip. editor. Ganguly, Karabi. editor. Sarkar, Indranath. editor. Biswas, Papun. editor.
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-81-322-2256-9
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6. 
Cover image for Innovations and Advances in Computing, Informatics, Systems Sciences, Networking and Engineering
Innovations and Advances in Computing, Informatics, Systems Sciences, Networking and Engineering
Author 
Sobh, Tarek. editor. Elleithy, Khaled. editor. SpringerLink (Online service)
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ONLINE
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https://doi.org/10.1007/978-3-319-06773-5
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7. 
Cover image for Precision Assembly Technologies and Systems 6th IFIP WG 5.5 International Precision Assembly Seminar, IPAS 2012, Chamonix, France, February 12-15, 2012. Proceedings
Precision Assembly Technologies and Systems 6th IFIP WG 5.5 International Precision Assembly Seminar, IPAS 2012, Chamonix, France, February 12-15, 2012. Proceedings
Author 
Ratchev, Svetan. editor. SpringerLink (Online service)
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Electronic Access 
http://dx.doi.org/10.1007/978-3-642-28163-1
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8. 
Cover image for Mechatronic Systems Analysis, Design and Implementation
Mechatronic Systems Analysis, Design and Implementation
Author 
Boukas, El-Kébir. author. AL-Sunni, Fouad M. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-3-642-22324-2
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9. 
Cover image for Nonsmooth Modeling and Simulation for Switched Circuits
Nonsmooth Modeling and Simulation for Switched Circuits
Author 
Acary, Vincent. author. Bonnefon, Olivier. author. Brogliato, Bernard. author. SpringerLink (Online service)
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Electronic Access 
http://dx.doi.org/10.1007/978-90-481-9681-4
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10. 
Cover image for Precision Assembly Technologies and Systems 5th IFIP WG 5.5 International Precision Assembly Seminar, IPAS 2010, Chamonix, France, February 14-17, 2010. Proceedings
Precision Assembly Technologies and Systems 5th IFIP WG 5.5 International Precision Assembly Seminar, IPAS 2010, Chamonix, France, February 14-17, 2010. Proceedings
Author 
Ratchev, Svetan. editor. SpringerLink (Online service)
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Electronic Access 
http://dx.doi.org/10.1007/978-3-642-11598-1
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11. 
Cover image for Languages for Embedded Systems and their Applications Selected Contributions on Specification, Design, and Verification from FDL’08
Languages for Embedded Systems and their Applications Selected Contributions on Specification, Design, and Verification from FDL’08
Author 
Radetzki, Martin. editor. SpringerLink (Online service)
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Electronic Access 
http://dx.doi.org/10.1007/978-1-4020-9714-0
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12. 
Cover image for Simulation of Semiconductor Processes and Devices 2007 SISPAD 2007
Simulation of Semiconductor Processes and Devices 2007 SISPAD 2007
Author 
Grasser, Tibor. editor. Selberherr, Siegfried. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-3-211-72861-1
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