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1. 
Cover image for Interface engineering in organic field-effect transistors
Interface engineering in organic field-effect transistors
Author 
Guo, Xuefeng, author. Chen, Hongliang, author.
Preferred Shelf Number 
QC173.4 .I57 G86 2023
Electronic Access 
https://onlinelibrary.wiley.com/doi/book/10.1002/9783527840489
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2. 
Cover image for Fundamentals of Lead-Free Solder Interconnect Technology From Microstructures to Reliability
Fundamentals of Lead-Free Solder Interconnect Technology From Microstructures to Reliability
Author 
Lee, Tae-Kyu. author. Bieler, Thomas R. author. Kim, Choong-Un. author. Ma, Hongtao. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-1-4614-9266-5
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Availability 
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3. 
Cover image for Copper Electrodeposition for Nanofabrication of Electronics Devices
Copper Electrodeposition for Nanofabrication of Electronics Devices
Author 
Kondo, Kazuo. editor. Akolkar, Rohan N. editor. Barkey, Dale P. editor. Yokoi, Masayuki. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-1-4614-9176-7
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Availability 
Online Library~1
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