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1. 
Cover image for Packaging for Sustainability
Packaging for Sustainability
Author 
Verghese, Karli. editor. Lewis, Helen. editor. Fitzpatrick, Leanne. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-0-85729-988-8
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2. 
Cover image for Integrated Circuit Packaging, Assembly and Interconnections
Integrated Circuit Packaging, Assembly and Interconnections
Author 
Greig, William J. author. SpringerLink (Online service)
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Electronic Access 
http://dx.doi.org/10.1007/0-387-33913-2
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3. 
Cover image for Systems-Level Packaging for Millimeter-Wave Transceivers
Systems-Level Packaging for Millimeter-Wave Transceivers
Author 
Božanić, Mladen. author. (orcid)0000-0001-9174-0781 Sinha, Saurabh. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-030-14690-0
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4. 
Cover image for Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging
Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging
Author 
Suhir, E. editor. Lee, Y. C. editor. Wong, C. P. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/0-387-32989-7
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5. 
Cover image for CAD, 3D Modeling, Engineering Analysis, and Prototype Experimentation Industrial and Research Applications
CAD, 3D Modeling, Engineering Analysis, and Prototype Experimentation Industrial and Research Applications
Author 
Zheng Li, Jeremy. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-05921-1
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