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1. 
Cover image for Lock-in Thermography Basics and Use for Evaluating Electronic Devices and Materials
Lock-in Thermography Basics and Use for Evaluating Electronic Devices and Materials
Author 
Breitenstein, Otwin. author. Warta, Wilhelm. author. Langenkamp, Martin. author. SpringerLink (Online service)
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ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-3-642-02417-7
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2. 
Cover image for The Physics of Solids Essentials and Beyond
The Physics of Solids Essentials and Beyond
Author 
Economou, Eleftherios N. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-3-642-02069-8
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3. 
Cover image for Structures Under Crash and Impact Continuum Mechanics, Discretization and Experimental Characterization
Structures Under Crash and Impact Continuum Mechanics, Discretization and Experimental Characterization
Author 
Hiermaier, Stefan Josef. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-0-387-73863-5
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4. 
Cover image for Micro- and Macro-Properties of Solids Thermal, Mechanical and Dielectric Properties
Micro- and Macro-Properties of Solids Thermal, Mechanical and Dielectric Properties
Author 
Sirdeshmukh, D. B. author. Sirdeshmukh, L. author. Subhadra, K. G. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1007/3-540-31786-4
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