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Cover image for Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering Wafer-Level Transfer Packaging and Fabrication Techniques Using Interface Energy Control Method
Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering Wafer-Level Transfer Packaging and Fabrication Techniques Using Interface Energy Control Method
Author 
Seok, Seonho. author. SpringerLink (Online service)
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ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-319-77872-3
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2. 
Cover image for Nonlinear Targeted Energy Transfer in Mechanical and Structural Systems
Nonlinear Targeted Energy Transfer in Mechanical and Structural Systems
Author 
Vakakis, A. F. author. Gendelman, O. V. author. Bergman, L. A. author. McFarland, D. M. author. Kerschen, G. author.
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-1-4020-9130-8
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