Limit Search Results
Author
Language
Publication Date
-
Subject
Material Type
Shelf Location
Library
Switch to list view
Switch to thumbnail view
Select an Action
4 Results Found Subscribe to search results
0000DEFAULT
Print
1. 
Cover image for Advances in Ceramic Materials and Processing
Advances in Ceramic Materials and Processing
Author 
Li, Bowen. editor. (orcid)0000-0002-6331-1629 Ghosh, Dipankar. editor. (orcid)0000-0002-4574-9600 Olevsky, Eugene A. editor. Lu, Kathy. editor. Dong, Faqin. editor. (orcid)0000-0002-5327-4449
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-031-80664-3
Format: 
Availability 
Online Library~1
Available:
Copies:
2. 
Cover image for 3D Microelectronic Packaging From Fundamentals to Applications
3D Microelectronic Packaging From Fundamentals to Applications
Author 
Li, Yan. editor. Goyal, Deepak. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-319-44586-1
Format: 
Availability 
Online Library~1
Available:
Copies:
3. 
Cover image for Materials for Advanced Packaging
Materials for Advanced Packaging
Author 
Lu, Daniel. editor. Wong, C.P. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-319-45098-8
Format: 
Availability 
Online Library~1
Available:
Copies:
4. 
Cover image for Materials and Processes for Spacecraft and High Reliability Applications
Materials and Processes for Spacecraft and High Reliability Applications
Author 
D. Dunn, Barrie. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-319-23362-8
Format: 
Availability 
Online Library~1
Available:
Copies: