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1. 
Cover image for Polymeric materials for electronic packaging
Polymeric materials for electronic packaging
Author 
Nakamura, Shozo (Professor Emeritus), author.
Preferred Shelf Number 
QD382 .C66 N35 2023
Electronic Access 
https://onlinelibrary.wiley.com/doi/book/10.1002/9781394188826
Format: 
Availability 
Online Library~1
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2. 
Cover image for From additive manufacturing to 3D/4D printing. 2, Current techniques, improvements and their limitations
From additive manufacturing to 3D/4D printing. 2, Current techniques, improvements and their limitations
Author 
André, Jean-Claude, author.
Preferred Shelf Number 
TS171.95
Electronic Access 
https://onlinelibrary.wiley.com/doi/book/10.1002/9781119428299
Format: 
Availability 
Online Library~1
Available:
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