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1. 
Cover image for Materials science in microelectronics
Materials science in microelectronics
Author 
Machlin, E. S.
Preferred Shelf Number 
ONLINE
Electronic Access 
ScienceDirect http://www.sciencedirect.com/science/book/9780080446394
ScienceDirect http://www.sciencedirect.com/science/book/9780080446400
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2. 
Cover image for Materials science in microelectronics
Materials science in microelectronics
Author 
Machlin, E. S.
Preferred Shelf Number 
TK 7871.15.F5 M32 2005
Format: 
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3. 
Cover image for Microelectronics to nanoelectronics materials, devices & manufacturability
Microelectronics to nanoelectronics materials, devices & manufacturability
Author 
Kaul, Anupama B.
Preferred Shelf Number 
ONLINE
Electronic Access 
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4. 
Cover image for Printing of Graphene and Related 2D Materials Technology, Formulation and Applications
Printing of Graphene and Related 2D Materials Technology, Formulation and Applications
Author 
Ng, Leonard W. T. author. Hu, Guohua. author. Howe, Richard C. T. author. Zhu, Xiaoxi. author. Yang, Zongyin. author.
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-319-91572-2
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5. 
Cover image for Micro- and opto-electronic materials and structures : physics, mechanics, design, reliability, packaging
Micro- and opto-electronic materials and structures : physics, mechanics, design, reliability, packaging
Author 
Suhir, Ephraim. Lee, Y. C. Wong, C. P.
Preferred Shelf Number 
TK7874 .M438 2007 V.1
Format: 
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6. 
Cover image for Advances in chemical mechanical planarization (CMP)
Advances in chemical mechanical planarization (CMP)
Author 
Babu, S. V., editor.
Preferred Shelf Number 
ONLINE
Electronic Access 
ScienceDirect http://www.sciencedirect.com/science/book/9780081001653
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7. 
Cover image for Fundamentals of Solid State Engineering
Fundamentals of Solid State Engineering
Author 
Razeghi, Manijeh. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-319-75708-7
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8. 
Cover image for Modeling and Application of Flexible Electronics Packaging
Modeling and Application of Flexible Electronics Packaging
Author 
Huang, YongAn. author. Yin, Zhouping. author. Wan, Xiaodong. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-981-13-3627-0
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9. 
Cover image for Printed Flexible Sensors Fabrication, Characterization and Implementation
Printed Flexible Sensors Fabrication, Characterization and Implementation
Author 
Nag, Anindya. author. Mukhopadhyay, Subhas Chandra. author. Kosel, Jurgen. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-030-13765-6
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10. 
Cover image for Novel advances in microsystems technologies and their applications
Novel advances in microsystems technologies and their applications
Author 
Francis, Laurent A., editor. Iniewski, Krzysztof, 1960- editor.
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ONLINE
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11. 
Cover image for Analog Filters in Nanometer CMOS
Analog Filters in Nanometer CMOS
Author 
Uhrmann, Heimo. author. Kolm, Robert. author. Zimmermann, Horst. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-642-38013-6
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12. 
Cover image for Thermal Management for LED Applications
Thermal Management for LED Applications
Author 
Lasance, Clemens J.M. editor. Poppe, András. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-1-4614-5091-7
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