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1. 
Cover image for Frontiers in Electronic Technologies Trends and Challenges
Frontiers in Electronic Technologies Trends and Challenges
Author 
Prabaharan, S.R.S. editor. Thalmann, Nadia Magnenat. editor. (orcid)0000-0002-1459-5960 Kanchana Bhaaskaran, V. S. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-981-10-4235-5
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2. 
Cover image for Electronic Structure of Quantum Confined Atoms and Molecules
Electronic Structure of Quantum Confined Atoms and Molecules
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Sen, K.D. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-09982-8
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3. 
Cover image for Micro and Nanoelectronics Devices, Circuits and Systems Select Proceedings of MNDCS 2024
Micro and Nanoelectronics Devices, Circuits and Systems Select Proceedings of MNDCS 2024
Author 
Guha, Koushik. editor. Saha, Samar Kanti. editor. (orcid)0000-0002-5687-591X Iannacci, Jacopo. editor. (orcid)0000-0001-6462-4814 SpringerLink (Online service)
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https://doi.org/10.1007/978-981-96-3758-4
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4. 
Cover image for Sensors and Microsystems Proceedings of AISEM 2025
Sensors and Microsystems Proceedings of AISEM 2025
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Di Natale, Corrado. editor. Lorenzelli, Leandro. editor. Mulloni, Viviana. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-032-08271-8
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5. 
Cover image for Micro and Nanoelectronics Devices, Circuits and Systems Select Proceedings of MNDCS 2023
Micro and Nanoelectronics Devices, Circuits and Systems Select Proceedings of MNDCS 2023
Author 
Lenka, Trupti Ranjan. editor. (orcid)0000-0002-8002-3901 Saha, Samar K. editor. (orcid)0000-0002-5687-591X Fu, Lan. editor. (orcid)0000-0002-9070-8373 SpringerLink (Online service)
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https://doi.org/10.1007/978-981-99-4495-8
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6. 
Cover image for Nanofabrication Principles, Capabilities and Limits
Nanofabrication Principles, Capabilities and Limits
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Cui, Zheng. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-031-62546-6
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7. 
Cover image for Micro and Nanoelectronics Devices, Circuits and Systems Select Proceedings of MNDCS 2022
Micro and Nanoelectronics Devices, Circuits and Systems Select Proceedings of MNDCS 2022
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Lenka, Trupti Ranjan. editor. Misra, Durgamadhab. editor. Fu, Lan. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-981-19-2308-1
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8. 
Cover image for Ultra-low Voltage Circuit Techniques for Energy Harvesting
Ultra-low Voltage Circuit Techniques for Energy Harvesting
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Radin, Rafael Luciano. author. Machado, Marcio Bender. author. Sawan, Mohamad. author. Galup-Montoro, Carlos. author. Schneider, Marcio Cherem. author.
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https://doi.org/10.1007/978-3-031-04492-2
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9. 
Cover image for Chiplet Design and Heterogeneous Integration Packaging
Chiplet Design and Heterogeneous Integration Packaging
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Lau, John H. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-981-19-9917-8
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10. 
Cover image for Materials for Advanced Packaging
Materials for Advanced Packaging
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Lu, Daniel. editor. Wong, C.P. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-45098-8
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11. 
Cover image for Emerging Trends in Electrical, Communications and Information Technologies Proceedings of ICECIT-2015
Emerging Trends in Electrical, Communications and Information Technologies Proceedings of ICECIT-2015
Author 
Attele, Kapila Rohan. editor. Kumar, Amit. editor. Sankar, V. editor. Rao, N. V. editor. Sarma, T. Hitendra. editor.
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https://doi.org/10.1007/978-981-10-1540-3
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12. 
Cover image for 3D Microelectronic Packaging From Fundamentals to Applications
3D Microelectronic Packaging From Fundamentals to Applications
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Li, Yan. editor. Goyal, Deepak. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-44586-1
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