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Cover image for Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering Wafer-Level Transfer Packaging and Fabrication Techniques Using Interface Energy Control Method
Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering Wafer-Level Transfer Packaging and Fabrication Techniques Using Interface Energy Control Method
Author 
Seok, Seonho. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-319-77872-3
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2. 
Cover image for Fiberglass and Glass Technology Energy-Friendly Compositions and Applications
Fiberglass and Glass Technology Energy-Friendly Compositions and Applications
Author 
Wallenberger, Frederick T. editor. Bingham, Paul A. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-1-4419-0736-3
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3. 
Cover image for Design of Advanced Photocatalytic Materials for Energy and Environmental Applications
Design of Advanced Photocatalytic Materials for Energy and Environmental Applications
Author 
Coronado, Juan M. editor. Fresno, Fernando. editor. Hernández-Alonso, María D. editor. Portela, Raquel. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE(331131.1)
Electronic Access 
http://dx.doi.org/10.1007/978-1-4471-5061-9
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Availability 
Online Library~1
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