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1. 
Cover image for Springer Handbook of Materials Measurement Methods
Springer Handbook of Materials Measurement Methods
Author 
Czichos, Horst. editor. Saito, Tetsuya. editor. Smith, Leslie. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-3-540-30300-8
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2. 
Cover image for Solder Joint Technology Materials, Properties, and Reliability
Solder Joint Technology Materials, Properties, and Reliability
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Tu, King-Ning. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-0-387-38892-2
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3. 
Cover image for Self Healing Materials An Alternative Approach to 20 Centuries of Materials Science
Self Healing Materials An Alternative Approach to 20 Centuries of Materials Science
Author 
Zwaag, Sybrand. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-1-4020-6250-6
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4. 
Cover image for Security and Reliability of Damaged Structures and Defective Materials
Security and Reliability of Damaged Structures and Defective Materials
Author 
Pluvinage, Guy. editor. Sedmak, Aleksandar. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-90-481-2792-4
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5. 
Cover image for IUTAM Symposium on Multiscale Modelling of Fatigue, Damage and Fracture in Smart Materials Proceedings of the IUTAM Symposium on Multiscale Modelling of Fatigue, Damage and Fracture in Smart Materials, held in Freiberg, Germany, September 1-4, 2009
IUTAM Symposium on Multiscale Modelling of Fatigue, Damage and Fracture in Smart Materials Proceedings of the IUTAM Symposium on Multiscale Modelling of Fatigue, Damage and Fracture in Smart Materials, held in Freiberg, Germany, September 1-4, 2009
Author 
Kuna, Meinhard. editor. Ricoeur, Andreas. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-90-481-9887-0
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6. 
Cover image for Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging
Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging
Author 
Suhir, E. editor. Lee, Y. C. editor. Wong, C. P. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/0-387-32989-7
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7. 
Cover image for Lead-Free Electronic Solders A Special Issue of the Journal of Materials Science: Materials in Electronics
Lead-Free Electronic Solders A Special Issue of the Journal of Materials Science: Materials in Electronics
Author 
Subramanian, K. N. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-0-387-48433-4
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8. 
Cover image for Blast Mitigation Experimental and Numerical Studies
Blast Mitigation Experimental and Numerical Studies
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Shukla, Arun. editor. Rajapakse, Yapa D. S. editor. Hynes, Mary Ellen. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-1-4614-7267-4
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9. 
Cover image for Fire Behavior and Fire Protection in Timber Buildings
Fire Behavior and Fire Protection in Timber Buildings
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Aseeva, Roza. author. Serkov, Boris. author. Sivenkov, Andrey. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-94-007-7460-5
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10. 
Cover image for Evaluating Measurement Accuracy A Practical Approach
Evaluating Measurement Accuracy A Practical Approach
Author 
Rabinovich, Semyon G. author. SpringerLink (Online service)
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ONLINE(332097.1)
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http://dx.doi.org/10.1007/978-1-4614-6717-5
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11. 
Cover image for Proceedings of the Institute of Industrial Engineers Asian Conference 2013
Proceedings of the Institute of Industrial Engineers Asian Conference 2013
Author 
Lin, Yi-Kuei. editor. Tsao, Yu-Chung. editor. Lin, Shi-Woei. editor. SpringerLink (Online service)
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ONLINE(336519.1)
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http://dx.doi.org/10.1007/978-981-4451-98-7
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12. 
Cover image for Computational Electromagnetics and Model-Based Inversion A Modern Paradigm for Eddy-Current Nondestructive Evaluation
Computational Electromagnetics and Model-Based Inversion A Modern Paradigm for Eddy-Current Nondestructive Evaluation
Author 
Sabbagh, Harold A. author. Murphy, R. Kim. author. Sabbagh, Elias H. author. Aldrin, John C. author. Knopp, Jeremy S. author.
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http://dx.doi.org/10.1007/978-1-4419-8429-6
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