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1. 
Cover image for Food packaging and preservation
Food packaging and preservation
Author 
Grumezescu, Alexandru Mihai. Holban, Alina Maria.
Preferred Shelf Number 
TP374 F686 2018
Format: 
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Beytepe Library~1
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2. 
Cover image for Bionanocomposites for Packaging Applications
Bionanocomposites for Packaging Applications
Author 
Jawaid, Mohammad. editor. Swain, Sarat Kumar. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-319-67319-6
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3. 
Cover image for Food packaging and preservation
Food packaging and preservation
Author 
Grumezescu, Alexandru Mihai, editor. Holban, Alina Maria, editor.
Preferred Shelf Number 
ONLINE
Electronic Access 
ScienceDirect https://www.sciencedirect.com/science/book/9780128115169
ScienceDirect http://www.sciencedirect.com/science/book/9780128115169
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4. 
Cover image for Fan-Out Wafer-Level Packaging
Fan-Out Wafer-Level Packaging
Author 
Lau, John H. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-981-10-8884-1
Format: 
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5. 
Cover image for Aseptic processing and packaging of food products
Aseptic processing and packaging of food products
Author 
Holdworth, S. D.
Preferred Shelf Number 
TP 371.2 H65 1992
Format: 
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6. 
Cover image for Nanomaterials for food packaging : materials, processing technologies, and safety issues
Nanomaterials for food packaging : materials, processing technologies, and safety issues
Author 
Cerqueira, Miguel Ângelo Parente Ribeiro, editor. Lagaron, Jose Maria, editor. Castro, Lorenzo Miguel Pastrana, editor. Vicente, António Augusto Martins de Oliveira Soares, editor.
Preferred Shelf Number 
ONLINE
Electronic Access 
ScienceDirect https://www.sciencedirect.com/science/book/9780323512718
Format: 
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7. 
Cover image for Wide Bandgap Power Semiconductor Packaging : Materials, Components, and Reliability
Wide Bandgap Power Semiconductor Packaging : Materials, Components, and Reliability
Author 
Suganuma, Katsuaki, editor.
Preferred Shelf Number 
ONLINE
Electronic Access 
ScienceDirect https://www.sciencedirect.com/science/book/9780081020944
Format: 
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8. 
Cover image for Applied Sciences in Graphic Communication and Packaging Proceedings of 2017 49th Conference of the International Circle of Educational Institutes for Graphic Arts Technology and Management & 8th China Academic Conference on Printing and Packaging
Applied Sciences in Graphic Communication and Packaging Proceedings of 2017 49th Conference of the International Circle of Educational Institutes for Graphic Arts Technology and Management & 8th China Academic Conference on Printing and Packaging
Author 
Zhao, Pengfei. editor. Ouyang, Yun. editor. Xu, Min. editor. Yang, Li. editor. Ren, Yuhui. editor.
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-981-10-7629-9
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9. 
Cover image for Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering Wafer-Level Transfer Packaging and Fabrication Techniques Using Interface Energy Control Method
Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering Wafer-Level Transfer Packaging and Fabrication Techniques Using Interface Energy Control Method
Author 
Seok, Seonho. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-319-77872-3
Format: 
Availability 
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