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1. 
Cover image for Materials science in microelectronics
Materials science in microelectronics
Author 
Machlin, E. S.
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ONLINE
Electronic Access 
ScienceDirect http://www.sciencedirect.com/science/book/9780080446394
ScienceDirect http://www.sciencedirect.com/science/book/9780080446400
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Cover image for Proceedings of the Third International Conference on Microelectronics, Computing and Communication Systems MCCS 2018
Proceedings of the Third International Conference on Microelectronics, Computing and Communication Systems MCCS 2018
Author 
Nath, Vijay. editor. Mandal, Jyotsna Kumar. editor. SpringerLink (Online service)
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ONLINE
Electronic Access 
https://doi.org/10.1007/978-981-13-7091-5
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3. 
Cover image for Proceeding of the Second International Conference on Microelectronics, Computing & Communication Systems (MCCS 2017)
Proceeding of the Second International Conference on Microelectronics, Computing & Communication Systems (MCCS 2017)
Author 
Nath, Vijay. editor. Mandal, Jyotsna Kumar. editor. SpringerLink (Online service)
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ONLINE
Electronic Access 
https://doi.org/10.1007/978-981-10-8234-4
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4. 
Cover image for Microelectronics, Electromagnetics and Telecommunications Proceedings of the Fourth ICMEET 2018
Microelectronics, Electromagnetics and Telecommunications Proceedings of the Fourth ICMEET 2018
Author 
Panda, Ganapati. editor. Satapathy, Suresh Chandra. editor. Biswal, Birendra. editor. Bansal, Ramesh. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-981-13-1906-8
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5. 
Cover image for Printed Flexible Sensors Fabrication, Characterization and Implementation
Printed Flexible Sensors Fabrication, Characterization and Implementation
Author 
Nag, Anindya. author. Mukhopadhyay, Subhas Chandra. author. Kosel, Jurgen. author. SpringerLink (Online service)
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Electronic Access 
https://doi.org/10.1007/978-3-030-13765-6
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6. 
Cover image for Printing of Graphene and Related 2D Materials Technology, Formulation and Applications
Printing of Graphene and Related 2D Materials Technology, Formulation and Applications
Author 
Ng, Leonard W. T. author. Hu, Guohua. author. Howe, Richard C. T. author. Zhu, Xiaoxi. author. Yang, Zongyin. author.
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https://doi.org/10.1007/978-3-319-91572-2
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7. 
Cover image for Design Automation for Differential MOS Current-Mode Logic Circuits
Design Automation for Differential MOS Current-Mode Logic Circuits
Author 
Badel, Stéphane. author. Baltaci, Can. author. Cevrero, Alessandro. author. Leblebici, Yusuf. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-91307-0
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8. 
Cover image for Fundamentals of Solid State Engineering
Fundamentals of Solid State Engineering
Author 
Razeghi, Manijeh. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-75708-7
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9. 
Cover image for Automated Broad and Narrow Band Impedance Matching for RF and Microwave Circuits
Automated Broad and Narrow Band Impedance Matching for RF and Microwave Circuits
Author 
Banerjee, Amal. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-99001-9
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10. 
Cover image for Device Physics, Modeling, Technology, and Analysis for Silicon MESFET
Device Physics, Modeling, Technology, and Analysis for Silicon MESFET
Author 
Amiri, Iraj Sadegh. author. Mohammadi, Hossein. author. Hosseinghadiry, Mahdiar. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-030-04513-5
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11. 
Cover image for Body Area Network Challenges and Solutions
Body Area Network Challenges and Solutions
Author 
Maheswar, R. editor. Kanagachidambaresan, G. R. editor. Jayaparvathy, R. editor. Thampi, Sabu M. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-030-00865-9
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12. 
Cover image for Instruments, Measurement Principles and Communication Technologies for Downhole Drilling Environments
Instruments, Measurement Principles and Communication Technologies for Downhole Drilling Environments
Author 
Gooneratne, Chinthaka P. author. Li, Bodong. author. Deffenbaugh, Max. author. Moellendick, Timothy. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-030-04900-3
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