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1. 
Cover image for Advanced Materials for Thermal Management of Electronic Packaging
Advanced Materials for Thermal Management of Electronic Packaging
Author 
Tong, Xingcun Colin. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-1-4419-7759-5
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2. 
Cover image for Lock-in Thermography Basics and Use for Evaluating Electronic Devices and Materials
Lock-in Thermography Basics and Use for Evaluating Electronic Devices and Materials
Author 
Breitenstein, Otwin. author. Warta, Wilhelm. author. Langenkamp, Martin. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-3-642-02417-7
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3. 
Cover image for Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging
Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging
Author 
Suhir, E. editor. Lee, Y. C. editor. Wong, C. P. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/0-387-32989-7
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4. 
Cover image for Lead-Free Electronic Solders A Special Issue of the Journal of Materials Science: Materials in Electronics
Lead-Free Electronic Solders A Special Issue of the Journal of Materials Science: Materials in Electronics
Author 
Subramanian, K. N. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-0-387-48433-4
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5. 
Cover image for Physics of Negative Refraction and Negative Index Materials Optical and Electronic Aspects and Diversified Approaches
Physics of Negative Refraction and Negative Index Materials Optical and Electronic Aspects and Diversified Approaches
Author 
Krowne, Clifford M. editor. Zhang, Yong. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-3-540-72132-1
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6. 
Cover image for Photoelectrochemical Hydrogen Production
Photoelectrochemical Hydrogen Production
Author 
van de Krol, Roel. editor. Grätzel, Michael. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-1-4614-1380-6
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7. 
Cover image for Sensor technologies for civil infrastructures. Volume 2, Applications in structural health monitoring
Sensor technologies for civil infrastructures. Volume 2, Applications in structural health monitoring
Author 
Wang, M. L., editor. Lynch, Jerome P. (Jerome Peter), editor. Sohn, H. (Hoon), editor.
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ONLINE(355767.1)
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ScienceDirect http://www.sciencedirect.com/science/book/9781782422426
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8. 
Cover image for Mercury cadmium telluride growth, properties, and applications
Mercury cadmium telluride growth, properties, and applications
Author 
Capper, Peter. Garland, James, 1933-
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Books24x7 http://www.books24x7.com/marc.asp?bookid=40949
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Volltext http://onlinelibrary.wiley.com/book/10.1002/9780470669464
ebrary http://site.ebrary.com/id/10419374
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9. 
Cover image for Moisture Sensitivity of Plastic Packages of IC Devices
Moisture Sensitivity of Plastic Packages of IC Devices
Author 
Fan, X.J. editor. Suhir, E. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-1-4419-5719-1
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10. 
Cover image for Sapphire Material, Manufacturing, Applications
Sapphire Material, Manufacturing, Applications
Author 
Pishchik, Valerian. author. Lytvynov, Leonid A. author. Dobrovinskaya, Elena R. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-0-387-85695-7
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11. 
Cover image for Handbook of carbon, graphite, diamond, and fullerenes properties, processing, and applications
Handbook of carbon, graphite, diamond, and fullerenes properties, processing, and applications
Author 
Pierson, Hugh O.
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ScienceDirect http://www.sciencedirect.com/science/book/9780815513391
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12. 
Cover image for Solid State Lighting Reliability Components to Systems
Solid State Lighting Reliability Components to Systems
Author 
van Driel, W.D. editor. Fan, X.J. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-1-4614-3067-4
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