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1. 
Cover image for Physics of Negative Refraction and Negative Index Materials Optical and Electronic Aspects and Diversified Approaches
Physics of Negative Refraction and Negative Index Materials Optical and Electronic Aspects and Diversified Approaches
Author 
Krowne, Clifford M. editor. Zhang, Yong. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-3-540-72132-1
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2. 
Cover image for Sensor technologies for civil infrastructures. Volume 2, Applications in structural health monitoring
Sensor technologies for civil infrastructures. Volume 2, Applications in structural health monitoring
Author 
Wang, M. L., editor. Lynch, Jerome P. (Jerome Peter), editor. Sohn, H. (Hoon), editor.
Preferred Shelf Number 
ONLINE(355767.1)
Electronic Access 
ScienceDirect http://www.sciencedirect.com/science/book/9781782422426
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3. 
Cover image for Fan-Out Wafer-Level Packaging
Fan-Out Wafer-Level Packaging
Author 
Lau, John H. author. SpringerLink (Online service)
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Electronic Access 
https://doi.org/10.1007/978-981-10-8884-1
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4. 
Cover image for Synthesis and Characterization of Piezotronic Materials for Application in Strain/Stress Sensing
Synthesis and Characterization of Piezotronic Materials for Application in Strain/Stress Sensing
Author 
Zhu, Ren. author. Yang, Rusen. author. SpringerLink (Online service)
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Electronic Access 
https://doi.org/10.1007/978-3-319-70038-0
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5. 
Cover image for Fundamentals of Nanoscaled Field Effect Transistors
Fundamentals of Nanoscaled Field Effect Transistors
Author 
Chaudhry, Amit. author. SpringerLink (Online service)
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ONLINE(332128.1)
Electronic Access 
http://dx.doi.org/10.1007/978-1-4614-6822-6
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6. 
Cover image for Bismuth-Containing Compounds
Bismuth-Containing Compounds
Author 
Li, Handong. editor. Wang, Zhiming M. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE(332391.1)
Electronic Access 
http://dx.doi.org/10.1007/978-1-4614-8121-8
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7. 
Cover image for Silicon-based Nanomaterials
Silicon-based Nanomaterials
Author 
Li, Handong. editor. Wu, Jiang. editor. Wang, Zhiming M. editor. SpringerLink (Online service)
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ONLINE(332396.1)
Electronic Access 
http://dx.doi.org/10.1007/978-1-4614-8169-0
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8. 
Cover image for Piezoresistor Design and Applications
Piezoresistor Design and Applications
Author 
Doll, Joseph C. author. Pruitt, Beth L. author. SpringerLink (Online service)
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ONLINE(332425.1)
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http://dx.doi.org/10.1007/978-1-4614-8517-9
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9. 
Cover image for Fabrication of Complex Optical Components From Mold Design to Product
Fabrication of Complex Optical Components From Mold Design to Product
Author 
Brinksmeier, Ekkard. editor. Riemer, Oltmann. editor. Gläbe, Ralf M. editor. SpringerLink (Online service)
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ONLINE(333648.1)
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http://dx.doi.org/10.1007/978-3-642-33001-8
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10. 
Cover image for Advanced Flip Chip Packaging
Advanced Flip Chip Packaging
Author 
Tong, Ho-Ming. editor. Lai, Yi-Shao. editor. Wong, C.P. editor. SpringerLink (Online service)
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ONLINE(330808.1)
Electronic Access 
http://dx.doi.org/10.1007/978-1-4419-5768-9
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11. 
Cover image for Tuneable Film Bulk Acoustic Wave Resonators
Tuneable Film Bulk Acoustic Wave Resonators
Author 
Gevorgian, Spartak Sh. author. Tagantsev, Alexander K. author. Vorobiev, Andrei K. author. SpringerLink (Online service)
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ONLINE(331105.1)
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http://dx.doi.org/10.1007/978-1-4471-4944-6
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12. 
Cover image for Solid State Lighting Reliability Components to Systems
Solid State Lighting Reliability Components to Systems
Author 
van Driel, W.D. editor. Fan, X.J. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE(331314.1)
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http://dx.doi.org/10.1007/978-1-4614-3067-4
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