Title:
Interconnect Reliability in Advanced Memory Device Packaging
Author:
Gan, Chong Leong,. author.
ISBN:
9783031267086
Edition:
1st ed. 2023.
Physical Description:
XVIII, 210 p. 100 illus., 89 illus. in color. online resource.
Series:
Springer Series in Reliability Engineering,
Contents:
Chapter 1: Advanced Memory and Device Packaging -- Chapter 2: Wearout Reliability-based Characterization in Memory Packaging -- Chapter 3: Recycling of Noble Metals Used in Memory Packaging -- Chapter 4: Advanced Flip Chip Packaging -- Chapter 5: Second Level Interconnect Reliability of Low Temperature Solder Materials Used in Memory Modules and Solid-State Drives (SSD) -- Chapter 6: Specific Packaging Reliability Testing -- Chapter 7: Reliability Simulation and Modeling in Memory Packaging -- Chapter 8: Interconnects Reliability for Future Cryogenic Memory Applications.
Added Author:
Added Corporate Author:
Electronic Access:
https://doi.org/10.1007/978-3-031-26708-6Copies:
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Library | Material Type | Item Barcode | Shelf Number | Status | Item Holds |
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Searching... | E-Book | 526838-1001 | ONLINE | Searching... | Searching... |