Switch to list view
Switch to thumbnail view
Select an Action
5 Results Found Subscribe to search results
00000DEFAULT
Print
1. 
Cover image for Lock-in Thermography Basics and Use for Evaluating Electronic Devices and Materials
Lock-in Thermography Basics and Use for Evaluating Electronic Devices and Materials
Author 
Breitenstein, Otwin. author. Warta, Wilhelm. author. Langenkamp, Martin. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-3-642-02417-7
Format: 
Availability 
Online Library~1
Available:
Copies:
2. 
Cover image for Bonding in Microsystem Technology
Bonding in Microsystem Technology
Author 
Dziuban, Jan A. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1007/1-4020-4589-1
Format: 
Availability 
Online Library~1
Available:
Copies:
3. 
Cover image for Proceedings of SIE 2022 53rd Annual Meeting of the Italian Electronics Society
Proceedings of SIE 2022 53rd Annual Meeting of the Italian Electronics Society
Author 
Cocorullo, Giuseppe. editor. Crupi, Felice. editor. Limiti, Ernesto. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-031-26066-7
Format: 
Availability 
Online Library~1
Available:
Copies:
4. 
Cover image for Selected Sensor Circuits From Data Sheet to Simulation
Selected Sensor Circuits From Data Sheet to Simulation
Author 
Baumann, Peter. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-658-38212-4
Format: 
Availability 
Online Library~1
Available:
Copies:
5. 
Cover image for Advanced Thermal Management Materials
Advanced Thermal Management Materials
Author 
Jiang, Guosheng. author. Diao, Liyong. author. Kuang, Ken. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE(331292.1)
Electronic Access 
http://dx.doi.org/10.1007/978-1-4614-1963-1
Format: 
Availability 
Online Library~1
Available:
Copies: