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1. 
Cover image for Micro and Nanoelectronics Devices, Circuits and Systems Select Proceedings of MNDCS 2024
Micro and Nanoelectronics Devices, Circuits and Systems Select Proceedings of MNDCS 2024
Author 
Guha, Koushik. editor. Saha, Samar Kanti. editor. (orcid)0000-0002-5687-591X Iannacci, Jacopo. editor. (orcid)0000-0001-6462-4814 SpringerLink (Online service)
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https://doi.org/10.1007/978-981-96-3758-4
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2. 
Cover image for Sensors and Microsystems Proceedings of AISEM 2025
Sensors and Microsystems Proceedings of AISEM 2025
Author 
Di Natale, Corrado. editor. Lorenzelli, Leandro. editor. Mulloni, Viviana. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-032-08271-8
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3. 
Cover image for Micro and Nanoelectronics Devices, Circuits and Systems Select Proceedings of MNDCS 2023
Micro and Nanoelectronics Devices, Circuits and Systems Select Proceedings of MNDCS 2023
Author 
Lenka, Trupti Ranjan. editor. (orcid)0000-0002-8002-3901 Saha, Samar K. editor. (orcid)0000-0002-5687-591X Fu, Lan. editor. (orcid)0000-0002-9070-8373 SpringerLink (Online service)
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https://doi.org/10.1007/978-981-99-4495-8
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4. 
Cover image for Nanofabrication Principles, Capabilities and Limits
Nanofabrication Principles, Capabilities and Limits
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Cui, Zheng. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-031-62546-6
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5. 
Cover image for Micro and Nanoelectronics Devices, Circuits and Systems Select Proceedings of MNDCS 2022
Micro and Nanoelectronics Devices, Circuits and Systems Select Proceedings of MNDCS 2022
Author 
Lenka, Trupti Ranjan. editor. Misra, Durgamadhab. editor. Fu, Lan. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-981-19-2308-1
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6. 
Cover image for Ultra-low Voltage Circuit Techniques for Energy Harvesting
Ultra-low Voltage Circuit Techniques for Energy Harvesting
Author 
Radin, Rafael Luciano. author. Machado, Marcio Bender. author. Sawan, Mohamad. author. Galup-Montoro, Carlos. author. Schneider, Marcio Cherem. author.
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https://doi.org/10.1007/978-3-031-04492-2
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7. 
Cover image for Chiplet Design and Heterogeneous Integration Packaging
Chiplet Design and Heterogeneous Integration Packaging
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Lau, John H. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-981-19-9917-8
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8. 
Cover image for Materials for Advanced Packaging
Materials for Advanced Packaging
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Lu, Daniel. editor. Wong, C.P. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-45098-8
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9. 
Cover image for 3D Microelectronic Packaging From Fundamentals to Applications
3D Microelectronic Packaging From Fundamentals to Applications
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Li, Yan. editor. Goyal, Deepak. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-44586-1
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10. 
Cover image for Outlook and Challenges of Nano Devices, Sensors, and MEMS
Outlook and Challenges of Nano Devices, Sensors, and MEMS
Author 
Li, Ting. editor. Liu, Ziv. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-50824-5
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11. 
Cover image for Nanovate Commercializing Disruptive Nanotechnologies
Nanovate Commercializing Disruptive Nanotechnologies
Author 
Anis, Mohab. author. AlTaher, Ghada. author. Sarhan, Wesam. author. Elsemary, Mona. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-44863-3
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12. 
Cover image for Next Generation Spin Torque Memories
Next Generation Spin Torque Memories
Author 
Kaushik, Brajesh Kumar. author. Verma, Shivam. author. Kulkarni, Anant Aravind. author. Prajapati, Sanjay. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-981-10-2720-8
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