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1. 
Cover image for Silicon Quantum Integrated Circuits Silicon-Germanium Heterostructure Devices: Basics and Realisations
Silicon Quantum Integrated Circuits Silicon-Germanium Heterostructure Devices: Basics and Realisations
Author 
Kasper, Erich. author. Paul, D.J. author. SpringerLink (Online service)
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ONLINE
Electronic Access 
http://dx.doi.org/10.1007/b137494
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2. 
Cover image for Gallium Nitride-enabled High Frequency and High Efficiency Power Conversion
Gallium Nitride-enabled High Frequency and High Efficiency Power Conversion
Author 
Meneghesso, Gaudenzio. editor. Meneghini, Matteo. editor. Zanoni, Enrico. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-77994-2
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3. 
Cover image for Applications of Organic and Printed Electronics A Technology-Enabled Revolution
Applications of Organic and Printed Electronics A Technology-Enabled Revolution
Author 
Cantatore, Eugenio. editor. SpringerLink (Online service)
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ONLINE(331320.1)
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http://dx.doi.org/10.1007/978-1-4614-3160-2
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4. 
Cover image for Three Dimensional Integrated Circuit Design EDA, Design and Microarchitectures
Three Dimensional Integrated Circuit Design EDA, Design and Microarchitectures
Author 
Xie, Yuan. editor. Cong, Jason. editor. Sapatnekar, Sachin. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-1-4419-0784-4
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5. 
Cover image for Carbon Nanotube Electronics
Carbon Nanotube Electronics
Author 
Kong, Jing. editor. Javey, Ali. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-0-387-69285-2
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6. 
Cover image for Organic Field Effect Transistors Theory, Fabrication and Characterization
Organic Field Effect Transistors Theory, Fabrication and Characterization
Author 
Kymissis, Ioannis. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-0-387-92134-1
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7. 
Cover image for Wafer Level 3-D ICs Process Technology
Wafer Level 3-D ICs Process Technology
Author 
Tan, Chuan Seng. editor. Gutmann, Ronald J. editor. Reif, L. Rafael. editor. SpringerLink (Online service)
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ONLINE
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http://dx.doi.org/10.1007/978-0-387-76534-1
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