Design-for-Test and Test Optimization Techniques for TSV-based 3D Stacked ICs

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Title:

Author:

Noia, Brandon. author.

ISBN:

9783319023786

Edition:

1st ed. 2014.

Physical Description:

XVIII, 245 p. 133 illus., 115 illus. in color. online resource.

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Library	Material Type	Item Barcode	Shelf Number	Status	Item Holds
Searching... Online Library	E-Book	487405-1001	ONLINE	Searching... Unknown	Searching... Unavailable