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1. 
Cover image for Integrated power devices and TCAD simulation
Integrated power devices and TCAD simulation
Author 
Fu, Yue (Electrical engineer), author. Li, Zhanming, author. Ng, Wai Tung, author. Sin, Johnny K. O., author.
Preferred Shelf Number 
ONLINE(356761.1)
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2. 
Cover image for Through-silicon vias for 3D integration
Through-silicon vias for 3D integration
Author 
Lau, John.
Preferred Shelf Number 
ONLINE
Electronic Access 
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