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1. 
Cover image for Wafer-Level Chip-Scale Packaging Analog and Power Semiconductor Applications
Wafer-Level Chip-Scale Packaging Analog and Power Semiconductor Applications
Author 
Qu, Shichun. author. Liu, Yong. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-1-4939-1556-9
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2. 
Cover image for MEMS/MOEMS packaging concepts, designs, materials, and processes
MEMS/MOEMS packaging concepts, designs, materials, and processes
Author 
Gilleo, Ken.
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ONLINE
Electronic Access 
Subscription required
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3. 
Cover image for Microwave Field-Effect Transistors Theory, design and applications
Microwave Field-Effect Transistors Theory, design and applications
Author 
Pengelly, Raymond S.
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ONLINE
Electronic Access 
http://dx.doi.org/10.1049/SBEW016E
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