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1. 
Cover image for MEMS Packaging
MEMS Packaging
Author 
Tai-Ran Hsu, ed.
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ONLINE
Electronic Access 
http://dx.doi.org/10.1049/PBEP003E
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2. 
Cover image for Investigation of aeronautical and engineering component failures
Investigation of aeronautical and engineering component failures
Author 
Reddy, A. Venugopal.
Preferred Shelf Number 
ONLINE
Electronic Access 
Distributed by publisher. Purchase or institutional license may be required for access.
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Availability 
Online Library~1
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