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1. 
Cover image for Infrared Ellipsometry on Semiconductor Layer Structures Phonons, Plasmons, and Polaritons
Infrared Ellipsometry on Semiconductor Layer Structures Phonons, Plasmons, and Polaritons
Author 
Schubert, Mathias. author. SpringerLink (Online service)
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ONLINE
Electronic Access 
http://dx.doi.org/10.1007/b11964
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2. 
Cover image for Introduction to Focused Ion Beams Instrumentation, Theory, Techniques and Practice
Introduction to Focused Ion Beams Instrumentation, Theory, Techniques and Practice
Author 
Giannuzzi, Lucille A. editor. Stevie, Fred A. editor. SpringerLink (Online service)
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ONLINE
Electronic Access 
http://dx.doi.org/10.1007/b101190
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3. 
Cover image for Multilayered Low Temperature Cofired Ceramics (LTCC) Technology
Multilayered Low Temperature Cofired Ceramics (LTCC) Technology
Author 
Imanaka, Yoshihiko. author. SpringerLink (Online service)
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ONLINE
Electronic Access 
http://dx.doi.org/10.1007/b101196
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4. 
Cover image for Complex Inorganic Solids Structural, Stability, and Magnetic Properties of Alloys
Complex Inorganic Solids Structural, Stability, and Magnetic Properties of Alloys
Author 
Turchi, Patrice E. A. editor. Gonis, Antonios. editor. Rajan, Krishna. editor. Meike, Annemarie. editor. SpringerLink (Online service)
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ONLINE
Electronic Access 
http://dx.doi.org/10.1007/b136491
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5. 
Cover image for Thin Films and Heterostructures for Oxide Electronics
Thin Films and Heterostructures for Oxide Electronics
Author 
Ogale, Satischandra B. author. SpringerLink (Online service)
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ONLINE
Electronic Access 
http://dx.doi.org/10.1007/b136780
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6. 
Cover image for Understanding Materials Science History · Properties · Applications
Understanding Materials Science History · Properties · Applications
Author 
Hummel, Rolf E. author. SpringerLink (Online service)
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ONLINE
Electronic Access 
http://dx.doi.org/10.1007/b137957
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7. 
Cover image for Materials for Information Technology Devices, Interconnects and Packaging
Materials for Information Technology Devices, Interconnects and Packaging
Author 
Zschech, Ehrenfried. editor. Whelan, Caroline. editor. Mikolajick, Thomas. editor. SpringerLink (Online service)
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ONLINE
Electronic Access 
http://dx.doi.org/10.1007/1-84628-235-7
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8. 
Cover image for Graded Ferroelectrics, Transpacitors and Transponents
Graded Ferroelectrics, Transpacitors and Transponents
Author 
Mantese, Joseph V. author. Alpay, S. Pamir. author. SpringerLink (Online service)
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ONLINE
Electronic Access 
http://dx.doi.org/10.1007/b101201
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9. 
Cover image for Theory of Thermomechanical Processes in Welding
Theory of Thermomechanical Processes in Welding
Author 
Służalec, Andrzej. author. SpringerLink (Online service)
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ONLINE
Electronic Access 
http://dx.doi.org/10.1007/1-4020-2991-8
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10. 
Cover image for Springer Handbook of Condensed Matter and Materials Data
Springer Handbook of Condensed Matter and Materials Data
Author 
Martienssen, Werner. editor. Warlimont, Hans. editor. SpringerLink (Online service)
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ONLINE
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http://dx.doi.org/10.1007/3-540-30437-1
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11. 
Cover image for An Introduction to Computational Micromechanics Corrected Second Printing
An Introduction to Computational Micromechanics Corrected Second Printing
Author 
Zohdi, Tarek I. editor. Wriggers, Peter. editor. SpringerLink (Online service)
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ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-3-540-32360-0
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12. 
Cover image for High Dielectric Constant Materials VLSI MOSFET Applications
High Dielectric Constant Materials VLSI MOSFET Applications
Author 
Huff, H.R. editor. Gilmer, D.C. editor. SpringerLink (Online service)
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ONLINE
Electronic Access 
http://dx.doi.org/10.1007/b137574
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13. 
Cover image for Werkstoffwissenschaften und Fertigungstechnik Eigenschaften, Vorgänge, Technologien
Werkstoffwissenschaften und Fertigungstechnik Eigenschaften, Vorgänge, Technologien
Author 
Ilschner, Bernhard. author. Singer, Robert F. author. SpringerLink (Online service)
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ONLINE
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http://dx.doi.org/10.1007/b137732
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14. 
Cover image for Metallopolymer Nanocomposites
Metallopolymer Nanocomposites
Author 
Pomogailo, Anatolii D. author. Kestelman, Vladimir N. author. SpringerLink (Online service)
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ONLINE
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http://dx.doi.org/10.1007/b137740
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15. 
Cover image for Physik der Halbleiterbauelemente Einführendes Lehrbuch für Ingenieure und Physiker
Physik der Halbleiterbauelemente Einführendes Lehrbuch für Ingenieure und Physiker
Author 
Thuselt, Frank. author. SpringerLink (Online service)
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ONLINE
Electronic Access 
http://dx.doi.org/10.1007/b138004
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16. 
Cover image for Werkstoffkunde für Ingenieure Grundlagen, Anwendung, Prüfung
Werkstoffkunde für Ingenieure Grundlagen, Anwendung, Prüfung
Author 
Roos, Eberhard. author. Maile, Karl. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1007/b138047
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