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1. 
Cover image for Materials science in microelectronics
Materials science in microelectronics
Author 
Machlin, E. S.
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ONLINE
Electronic Access 
ScienceDirect http://www.sciencedirect.com/science/book/9780080446394
ScienceDirect http://www.sciencedirect.com/science/book/9780080446400
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2. 
Cover image for Deterministic Solvers for the Boltzmann Transport Equation
Deterministic Solvers for the Boltzmann Transport Equation
Author 
Hong, Sung-Min. author. Pham, Anh-Tuan. author. Jungemann, Christoph. author. SpringerLink (Online service)
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ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-3-7091-0778-2
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3. 
Cover image for Strain-Induced Effects in Advanced MOSFETs
Strain-Induced Effects in Advanced MOSFETs
Author 
Sverdlov, Viktor. author. SpringerLink (Online service)
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ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-3-7091-0382-1
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4. 
Cover image for Advanced Materials for Thermal Management of Electronic Packaging
Advanced Materials for Thermal Management of Electronic Packaging
Author 
Tong, Xingcun Colin. author. SpringerLink (Online service)
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ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-1-4419-7759-5
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5. 
Cover image for Low Power and Reliable SRAM Memory Cell and Array Design
Low Power and Reliable SRAM Memory Cell and Array Design
Author 
Ishibashi, Koichiro. editor. Osada, Kenichi. editor. SpringerLink (Online service)
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ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-3-642-19568-6
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6. 
Cover image for CMOS biomicrosystems where electronics meet biology
CMOS biomicrosystems where electronics meet biology
Author 
Iniewski, Krzysztof, 1960- Wiley InterScience (Online service)
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ONLINE
Electronic Access 
IEEE Xplore http://ieeexplore.ieee.org/xpl/bkabstractplus.jsp?bkn=5988887
IEEE Xplore http://ieeexplore.ieee.org/servlet/opac?bknumber=5988887
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7. 
Cover image for Design for embedded image processing on FPGAs
Design for embedded image processing on FPGAs
Author 
Bailey, Donald G. (Donald Graeme), 1962-
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IEEE Xplore http://ieeexplore.ieee.org/servlet/opac?bknumber=6016259
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8. 
Cover image for 3D IC stacking technology
3D IC stacking technology
Author 
Wu, Banqiu. Kumar, Ajay. Ramaswami, Sesh.
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Subscription required
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9. 
Cover image for Digital holography for MEMS and microsystem metrology
Digital holography for MEMS and microsystem metrology
Author 
Asundi, Anand.
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ONLINE
Electronic Access 
John Wiley http://dx.doi.org/10.1002/9781119997290
http://lib.myilibrary.com?id=317798
http://public.eblib.com/EBLPublic/PublicView.do?ptiID=697681
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10. 
Cover image for Silicon science and advanced micro-device engineering I selected, peer reviewed papers from the 5th International Symposium on Silicon Science and the 1st International Conference on Advanced Micro-Device Engineering (ISSS & AMDE 2009), was held by the International Education and Research Center for Silicon Science and the Advanced Technology Research Center (ATEC), Gunma University on 10 and 11 December 2009 in Kiryu, Japan
Silicon science and advanced micro-device engineering I selected, peer reviewed papers from the 5th International Symposium on Silicon Science and the 1st International Conference on Advanced Micro-Device Engineering (ISSS & AMDE 2009), was held by the International Education and Research Center for Silicon Science and the Advanced Technology Research Center (ATEC), Gunma University on 10 and 11 December 2009 in Kiryu, Japan
Author 
International Symposium on Silicon Science (5th : 2009 : Kiryū-shi, Japan) Hanaizumi, Osamu. Unno, Masafumi. Gunma Daigaku. International Education and Research Center for Silicon Science. Gunma Daigaku. Advanced Technology Research Center.
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EBSCOhost http://search.ebscohost.com/login.aspx?direct=true&scope=site&db=nlebk&db=nlabk&AN=553111
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