Cover image for Wide Bandgap Power Semiconductor Packaging : Materials, Components, and Reliability
Title:
Wide Bandgap Power Semiconductor Packaging : Materials, Components, and Reliability
Author:
Suganuma, Katsuaki, editor.
ISBN:
9780081020951
Physical Description:
1 online resource.
Series:
Woodhead Publishing series in electronic and optical materials

Woodhead Publishing series in electronic and optical materials.
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E-Book 460117-1001 ONLINE
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