Cover image for MEMS Packaging
Title:
MEMS Packaging
Author:
Tai-Ran Hsu, ed.
ISBN:
9781849190626
Publication Information:
Stevenage : IET, 2004.
Physical Description:
1 online resource (305 p.)
Series:
Circuits, Devices and Systems
Series Title:
Circuits, Devices and Systems
Subject Term:
Aerospace engineering.

Bonding.

Design.

Electronic packaging.

Microfabrication.

Micromechanics.

Sealing (Technology).

Telecommunication.
Added Author:
Tai-Ran Hsu,
Electronic Access:
http://dx.doi.org/10.1049/PBEP003E
Holds:
Copies:

Available:*

Library
Material Type
Item Barcode
Shelf Number
Status
Item Holds
Searching...
 E-Book 247779-1001 ONLINE
Searching...

On Order