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2013
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1. 
Cover image for Advanced Flip Chip Packaging
Advanced Flip Chip Packaging
Author 
Tong, Ho-Ming. editor. Lai, Yi-Shao. editor. Wong, C.P. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE(330808.1)
Electronic Access 
http://dx.doi.org/10.1007/978-1-4419-5768-9
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2. 
Cover image for On-chip High-Voltage Generator Design
On-chip High-Voltage Generator Design
Author 
Tanzawa, Toru. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE(331384.1)
Electronic Access 
http://dx.doi.org/10.1007/978-1-4614-3849-6
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3. 
Cover image for Modeling, Analysis and Optimization of Network-on-Chip Communication Architectures
Modeling, Analysis and Optimization of Network-on-Chip Communication Architectures
Author 
Ogras, Umit Y. author. Marculescu, Radu. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE(335726.1)
Electronic Access 
http://dx.doi.org/10.1007/978-94-007-3958-1
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