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1. 
Cover image for Advances in embedded and fan-out wafer level packaging technologies
Advances in embedded and fan-out wafer level packaging technologies
Author 
Keser, Beth, 1971- editor. Kroehnert, Steffen, 1970- editor.
Preferred Shelf Number 
TK7870.17 .A38 2019
Electronic Access 
https://onlinelibrary.wiley.com/doi/book/10.1002/9781119313991
Format: 
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2. 
Cover image for Handbook of 3D integration. Volume 4, Design, test, and thermal management
Handbook of 3D integration. Volume 4, Design, test, and thermal management
Author 
Franzon, Paul D., editor. Marinissen, Eric Jan, editor. Bakir, Muhannad S., editor.
Preferred Shelf Number 
TK7874.893 .H36 2019
Electronic Access 
https://onlinelibrary.wiley.com/doi/book/10.1002/9783527697052
Format: 
Availability 
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3. 
Cover image for SiP-system in package design and simulation : Mentor EE Flow Advanced Design Guide
SiP-system in package design and simulation : Mentor EE Flow Advanced Design Guide
Author 
Li, Suny, 1974- author.
Preferred Shelf Number 
TK7874
Electronic Access 
https://onlinelibrary.wiley.com/doi/book/10.1002/9781119045991
Format: 
Availability 
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4. 
Cover image for Understanding Delta-Sigma Data Converters.
Understanding Delta-Sigma Data Converters.
Author 
Pavan, Shanthi, 1973- Schreier, Richard. Temes, Gabor C.
Preferred Shelf Number 
TK7887.6
Electronic Access 
https://onlinelibrary.wiley.com/doi/book/10.1002/9781119258308
Format: 
Availability 
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Available:
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