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1. 
Cover image for Geomagnetics for Aeronautical Safety A Case Study in and around the Balkans
Geomagnetics for Aeronautical Safety A Case Study in and around the Balkans
Author 
Rasson, Jean L. editor. Delipetrov, Todor. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-1-4020-5025-1
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2. 
Cover image for Advanced Microsystems for Automotive Applications 2009 Smart Systems for Safety, Sustainability, and Comfort
Advanced Microsystems for Automotive Applications 2009 Smart Systems for Safety, Sustainability, and Comfort
Author 
Meyer, Gereon. editor. Valldorf, Jürgen. editor. Gessner, Wolfgang. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-3-642-00745-3
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3. 
Cover image for Dependable Multicore Architectures at Nanoscale
Dependable Multicore Architectures at Nanoscale
Author 
Ottavi, Marco. editor. Gizopoulos, Dimitris. editor. Pontarelli, Salvatore. editor. SpringerLink (Online service)
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ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-319-54422-9
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4. 
Cover image for Sensing Technology: Current Status and Future Trends III
Sensing Technology: Current Status and Future Trends III
Author 
Mason, Alex. editor. Mukhopadhyay, Subhas Chandra. editor. Jayasundera, Krishanthi Padmarani. editor. SpringerLink (Online service)
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Electronic Access 
https://doi.org/10.1007/978-3-319-10948-0
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5. 
Cover image for Reliability Engineering Theory and Practice
Reliability Engineering Theory and Practice
Author 
Birolini, Alessandro. author. SpringerLink (Online service)
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ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-642-39535-2
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6. 
Cover image for Bias Temperature Instability for Devices and Circuits
Bias Temperature Instability for Devices and Circuits
Author 
Grasser, Tibor. editor. SpringerLink (Online service)
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ONLINE
Electronic Access 
https://doi.org/10.1007/978-1-4614-7909-3
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7. 
Cover image for Design for Manufacturability From 1D to 4D for 90–22 nm Technology Nodes
Design for Manufacturability From 1D to 4D for 90–22 nm Technology Nodes
Author 
Balasinski, Artur. author. SpringerLink (Online service)
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ONLINE
Electronic Access 
https://doi.org/10.1007/978-1-4614-1761-3
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8. 
Cover image for Reliability Physics and Engineering Time-To-Failure Modeling
Reliability Physics and Engineering Time-To-Failure Modeling
Author 
McPherson, J. W. author. SpringerLink (Online service)
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ONLINE(332682.1)
Electronic Access 
http://dx.doi.org/10.1007/978-3-319-00122-7
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9. 
Cover image for Reliability of Microtechnology Interconnects, Devices and Systems
Reliability of Microtechnology Interconnects, Devices and Systems
Author 
Liu, Johan. author. Salmela, Olli. author. Sarkka, Jussi. author. Morris, James E. author. Tegehall, Per-Erik. author.
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-1-4419-5760-3
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10. 
Cover image for The ELFNET Book on Failure Mechanisms, Testing Methods, and Quality Issues of Lead-Free Solder Interconnects
The ELFNET Book on Failure Mechanisms, Testing Methods, and Quality Issues of Lead-Free Solder Interconnects
Author 
Grossmann, Günter. editor. Zardini, Christian. editor. SpringerLink (Online service)
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ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-0-85729-236-0
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11. 
Cover image for Applications of Finite Element Methods for Reliability Studies on ULSI Interconnections
Applications of Finite Element Methods for Reliability Studies on ULSI Interconnections
Author 
Tan, Cher Ming. author. Li, Wei. author. Gan, Zhenghao. author. Hou, Yuejin. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-0-85729-310-7
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12. 
Cover image for Reliability Engineering Theory and Practice
Reliability Engineering Theory and Practice
Author 
Birolini, Alessandro. author. SpringerLink (Online service)
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ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-3-642-14952-8
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13. 
Cover image for Reliability Physics and Engineering Time-To-Failure Modeling
Reliability Physics and Engineering Time-To-Failure Modeling
Author 
McPherson, J.W. author. SpringerLink (Online service)
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ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-1-4419-6348-2
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14. 
Cover image for Solder Joint Reliability Prediction for Multiple Environments
Solder Joint Reliability Prediction for Multiple Environments
Author 
Perkins, Andrew E. author. Sitaraman, Suresh K. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-0-387-79394-8
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15. 
Cover image for Montage in der Leistungselektronik für globale Märkte Design, Konzepte, Strategien
Montage in der Leistungselektronik für globale Märkte Design, Konzepte, Strategien
Author 
Feldmann, Klaus. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-3-540-87972-5
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16. 
Cover image for Precision Manufacturing
Precision Manufacturing
Author 
Dornfeld, David. author. Lee, Dae-Eun. author. SpringerLink (Online service)
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ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-0-387-68208-2
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17. 
Cover image for Emerging Nanotechnologies Test, Defect Tolerance, and Reliability
Emerging Nanotechnologies Test, Defect Tolerance, and Reliability
Author 
Tehranipoor, Mohammad. editor. SpringerLink (Online service)
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ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-0-387-74747-7
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18. 
Cover image for Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging
Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging
Author 
Suhir, E. editor. Lee, Y. C. editor. Wong, C. P. editor. SpringerLink (Online service)
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ONLINE
Electronic Access 
http://dx.doi.org/10.1007/0-387-32989-7
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19. 
Cover image for Solder Joint Technology Materials, Properties, and Reliability
Solder Joint Technology Materials, Properties, and Reliability
Author 
Tu, King-Ning. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-0-387-38892-2
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20. 
Cover image for A Guide to Lead-free Solders Physical Metallurgy and Reliability
A Guide to Lead-free Solders Physical Metallurgy and Reliability
Author 
Evans, John W. author. Engelmaier, Werner. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-1-84628-310-9
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21. 
Cover image for Reliability Engineering Theory and Practice
Reliability Engineering Theory and Practice
Author 
Birolini, Alessandro. author. SpringerLink (Online service)
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ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-3-540-49390-7
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22. 
Cover image for Lead-Free Electronic Solders A Special Issue of the Journal of Materials Science: Materials in Electronics
Lead-Free Electronic Solders A Special Issue of the Journal of Materials Science: Materials in Electronics
Author 
Subramanian, K. N. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-0-387-48433-4
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23. 
Cover image for Electronics Process Technology Production Modelling, Simulation and Optimisation
Electronics Process Technology Production Modelling, Simulation and Optimisation
Author 
Sauer, Wilfried. author. Oppermann, Martin. author. Werner, Sebastian. author. Wohlrabe, Heinz. author. Zerna, Thomas. author.
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1007/1-84628-354-X
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24. 
Cover image for Force Sensors for Microelectronic Packaging Applications
Force Sensors for Microelectronic Packaging Applications
Author 
Schwizer, Jürg. author. Mayer, Michael. author. Brand, Oliver. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1007/b138345
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25. 
Cover image for Green electronics/green bottom line environmentally responsible engineering
Green electronics/green bottom line environmentally responsible engineering
Author 
Goldberg, Lee H. Middleton, Wendy.
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Volltext http://www.sciencedirect.com/science/book/9780750699938
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