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1. 
Cover image for Molecular Modeling and Multiscaling Issues for Electronic Material Applications Volume 2
Molecular Modeling and Multiscaling Issues for Electronic Material Applications Volume 2
Author 
Wymyslowski, Artur. editor. Iwamoto, Nancy. editor. Yuen, Matthew. editor. Fan, Haibo. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-12862-7
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2. 
Cover image for Numerical Simulation of Mechatronic Sensors and Actuators Finite Elements for Computational Multiphysics
Numerical Simulation of Mechatronic Sensors and Actuators Finite Elements for Computational Multiphysics
Author 
Kaltenbacher, Manfred. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-642-40170-1
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3. 
Cover image for Silicon Carbide Nanostructures Fabrication, Structure, and Properties
Silicon Carbide Nanostructures Fabrication, Structure, and Properties
Author 
Fan, Jiyang. author. Chu, Paul K. author. SpringerLink (Online service)
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ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-319-08726-9
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