Title:
Green electronics manufacturing creating environmental sensible products
Author:
Wang, John X., 1962-
ISBN:
9781439826690
Publication Information:
Boca Raton, Fla. : CRC Press, 2013.
Physical Description:
xv, 344 p. : ill., port.
Contents:
1. Green electronic assembly : strategic industry interconnection direction -- 2. Tin whiskers : new challenge for long-term RoHS reliability -- 3. Fatigue characterization of lead-free solders -- 4. Lead-free electronic reliability : finite element modeling -- 5. Lead-free electronic reliability : fatigue life model -- 6. Lead-free electronic reliability : higher temperature -- 7. Fatigue design of lead-free electronics and Weibull distribution -- 8. Enhancing reliability of ball grid array -- 9. Finite element modeling under high-vibration and high-temperature environments -- 10. Probabilistic modeling of the elastic-plastic behavior of 63Sn-37Pb solder alloys -- 11. Flip-chip assembly for lead-free electronics -- 12. Flip-chip bonding technique for lead-free electronics -- 13. Flip-chip bonding of opto-electronic integrated circuits -- 14. Let's package a lead-free electronic design.
Abstract:
"Written for scientists and engineers involved in creating environmentally sensible products and technologies, Green Electronic Manufacturing offers an approach to designing electronics with special consideration for the environmental impacts of the product during its entire lifecycle, from raw material mining to end-of-life disposal or recycling. Examining the vast implications of eco-design on business and technology, this book goes beyond "green-practice" in the manufacturing process to discuss responsible electronics development as a management philosophy, design paradigm, and corporate culture toward an ultimately holistic environmental custodianship and commitment to society"-- Provided by publisher.
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Searching... | E-Book | 291642-1001 | ONLINE | Searching... | Searching... |