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1. 
Cover image for Modeling High Temperature Materials Behavior for Structural Analysis Part II. Solution Procedures and Structural Analysis Examples
Modeling High Temperature Materials Behavior for Structural Analysis Part II. Solution Procedures and Structural Analysis Examples
Author 
Naumenko, Konstantin. author. Altenbach, Holm. author. SpringerLink (Online service)
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ONLINE
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https://doi.org/10.1007/978-3-030-20381-8
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2. 
Cover image for Structural Properties of Porous Materials and Powders Used in Different Fields of Science and Technology
Structural Properties of Porous Materials and Powders Used in Different Fields of Science and Technology
Author 
Volfkovich, Yury Mironovich. author. Filippov, Anatoly Nikolaevich. author. Bagotsky, Vladimir Sergeevich. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-1-4471-6377-0
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3. 
Cover image for Mechanics of materials : a modern integration of mechanics and materials in structural design
Mechanics of materials : a modern integration of mechanics and materials in structural design
Author 
Jenkins, Christopher H. M. Khanna, Sanjeev K.
Preferred Shelf Number 
TA658 .J46 2005
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Beytepe Library~1
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4. 
Cover image for Applied materials science applications of engineering materials in structural, electronics, thermal, and other industries
Applied materials science applications of engineering materials in structural, electronics, thermal, and other industries
Author 
Chung, Deborah D. L.
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5. 
Cover image for Thin-walled Laminated Structures Buckling, Vibrations and Their Suppression
Thin-walled Laminated Structures Buckling, Vibrations and Their Suppression
Author 
Mikhasev, Gennadi I. author. Altenbach, Holm. author. SpringerLink (Online service)
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ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-030-12761-9
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6. 
Cover image for Theory of Electroelasticity
Theory of Electroelasticity
Author 
Kuang, Zhen-Bang. author. SpringerLink (Online service)
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ONLINE
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https://doi.org/10.1007/978-3-642-36291-0
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7. 
Cover image for Encyclopedia of Thermal Stresses
Encyclopedia of Thermal Stresses
Author 
Hetnarski, Richard B. editor. SpringerLink (Online service)
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ONLINE
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https://doi.org/10.1007/978-94-007-2739-7
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8. 
Cover image for Multiporphyrin arrays fundamentals and applications
Multiporphyrin arrays fundamentals and applications
Author 
Kim, Dongho, 1957-
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