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1. 
Cover image for MEMS fundamental technology and applications
MEMS fundamental technology and applications
Author 
Choudhary, Vikas. Iniewski, Krzysztof.
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2. 
Cover image for Semiconductor packaging materials interaction and reliability
Semiconductor packaging materials interaction and reliability
Author 
Chen, Andrea. Lo, Randy.
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3. 
Cover image for MEMS/MOEMS packaging concepts, designs, materials, and processes
MEMS/MOEMS packaging concepts, designs, materials, and processes
Author 
Gilleo, Ken.
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