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1. 
Cover image for Passive RF component technology: materials, techniques, and applications
Passive RF component technology: materials, techniques, and applications
Author 
Wang, Guo'an. Pan, Bo.
Preferred Shelf Number 
TK6560 P315 2012
Format: 
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Beytepe Library~1
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2. 
Cover image for MEMS/MOEMS packaging concepts, designs, materials, and processes
MEMS/MOEMS packaging concepts, designs, materials, and processes
Author 
Gilleo, Ken.
Preferred Shelf Number 
ONLINE
Electronic Access 
Subscription required
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Online Library~1
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3. 
Cover image for Passive RF & microwave integrated circuits
Passive RF & microwave integrated circuits
Author 
Maloratsky, Leo G.
Preferred Shelf Number 
ONLINE
Electronic Access 
ScienceDirect http://www.sciencedirect.com/science/book/9780750676991
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4. 
Cover image for Integrated passive component technology
Integrated passive component technology
Author 
Ulrich, Richard K. (Richard Kevin), 1955- Schaper, Leonard W.
Preferred Shelf Number 
ONLINE
Electronic Access 
IEEE Xplore http://ieeexplore.ieee.org/xpl/bkabstractplus.jsp?bkn=5426840
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Online Library~1
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5. 
Cover image for Lumped elements for RF and microwave circuits
Lumped elements for RF and microwave circuits
Author 
Bahl, I. J.
Preferred Shelf Number 
TK 7874.54 B34 2003
Format: 
Availability 
Beytepe Library~1
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