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1. 
Cover image for Silicon Wafer Bonding Technology for VLSI and MEMS Applications
Silicon Wafer Bonding Technology for VLSI and MEMS Applications
Author 
Iyer, S. S., ed. Auberton-Herv�, A. J., e
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1049/PBEP001E
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2. 
Cover image for Strained Silicon Heterostructures Materials and devices
Strained Silicon Heterostructures Materials and devices
Author 
Maiti, C. K., ed. Chakrabarti, N. B., ed. Ray, S. K., ed.
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1049/PBCS012E
Format: 
Availability 
Online Library~1
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