Cover image for Copper Electrodeposition for Nanofabrication of Electronics Devices
Title:
Copper Electrodeposition for Nanofabrication of Electronics Devices
Author:
Kondo, Kazuo. editor.
ISBN:
9781461491767
Edition:
1st ed. 2014.
Physical Description:
VIII, 282 p. 190 illus., 75 illus. in color. online resource.
Series:
Nanostructure Science and Technology, 171
Contents:
Copper Electrodeposition -- Suppression Effect and Additive Chemistry -- Acceleration Effect -- Modeling and Simulation -- Frontiers of Cu Electrodeposition and Electroless Plating for On-Chip Interconnects -- Microstructure of Evolution of Copper in Nano-scale Interconnect Features -- Direct Copper Plating -- Through Silicon Via -- Build-up Printed Wiring Boards -- Copper Foil Smooth on Both Sides for Lithium Ion Battery -- Through Hole Plating.
Added Corporate Author:
Holds:

Copies:

Library
Click to Sort
Material Type
Click to Sort
Item Barcode
Click to Sort
Shelf Number
Click to Sort
Status
Click to Sort
Item Holds
Click to Sort
Searching...
E-Book 530918-1001 ONLINE
Searching...