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Title:
Copper Electrodeposition for Nanofabrication of Electronics Devices
Author:
Kondo, Kazuo. editor.
ISBN:
9781461491767
Edition:
1st ed. 2014.
Physical Description:
VIII, 282 p. 190 illus., 75 illus. in color. online resource.
Series:
Nanostructure Science and Technology, 171
Contents:
Copper Electrodeposition -- Suppression Effect and Additive Chemistry -- Acceleration Effect -- Modeling and Simulation -- Frontiers of Cu Electrodeposition and Electroless Plating for On-Chip Interconnects -- Microstructure of Evolution of Copper in Nano-scale Interconnect Features -- Direct Copper Plating -- Through Silicon Via -- Build-up Printed Wiring Boards -- Copper Foil Smooth on Both Sides for Lithium Ion Battery -- Through Hole Plating.
Added Corporate Author:
Electronic Access:
https://doi.org/10.1007/978-1-4614-9176-7Copies: