Cover image for Design-for-Test and Test Optimization Techniques for TSV-based 3D Stacked ICs
Title:
Design-for-Test and Test Optimization Techniques for TSV-based 3D Stacked ICs
Author:
Noia, Brandon. author.
ISBN:
9783319023786
Edition:
1st ed. 2014.
Physical Description:
XVIII, 245 p. 133 illus., 115 illus. in color. online resource.
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E-Book 487405-1001 ONLINE
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