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1. 
Cover image for MEMS Reliability
MEMS Reliability
Author 
Hartzell, Allyson L. author. da Silva, Mark G. author. Shea, Herbert R. author. SpringerLink (Online service)
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ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-1-4419-6018-4
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2. 
Cover image for Analog IC Reliability in Nanometer CMOS
Analog IC Reliability in Nanometer CMOS
Author 
Maricau, Elie. author. Gielen, Georges. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE(331961.1)
Electronic Access 
http://dx.doi.org/10.1007/978-1-4614-6163-0
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3. 
Cover image for Lead Free Solder Mechanics and Reliability
Lead Free Solder Mechanics and Reliability
Author 
Pang, John Hock Lye. author. SpringerLink (Online service)
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ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-1-4614-0463-7
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4. 
Cover image for Semiconductor Power Devices Physics, Characteristics, Reliability
Semiconductor Power Devices Physics, Characteristics, Reliability
Author 
Lutz, Josef. author. Schlangenotto, Heinrich. author. Scheuermann, Uwe. author. De Doncker, Rik. author. SpringerLink (Online service)
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ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-3-642-11125-9
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5. 
Cover image for Reliability Engineering Theory and Practice
Reliability Engineering Theory and Practice
Author 
Birolini, Alessandro. author. SpringerLink (Online service)
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ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-3-642-14952-8
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6. 
Cover image for Reliability Engineering Theory and Practice
Reliability Engineering Theory and Practice
Author 
Birolini, Alessandro. author. SpringerLink (Online service)
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ONLINE
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http://dx.doi.org/10.1007/978-3-540-49390-7
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7. 
Cover image for Solid State Lighting Reliability Components to Systems
Solid State Lighting Reliability Components to Systems
Author 
van Driel, W.D. editor. Fan, X.J. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE(331314.1)
Electronic Access 
http://dx.doi.org/10.1007/978-1-4614-3067-4
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8. 
Cover image for Reliability of Microtechnology Interconnects, Devices and Systems
Reliability of Microtechnology Interconnects, Devices and Systems
Author 
Liu, Johan. author. Salmela, Olli. author. Sarkka, Jussi. author. Morris, James E. author. Tegehall, Per-Erik. author.
Preferred Shelf Number 
ONLINE
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http://dx.doi.org/10.1007/978-1-4419-5760-3
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9. 
Cover image for Solder Joint Reliability Prediction for Multiple Environments
Solder Joint Reliability Prediction for Multiple Environments
Author 
Perkins, Andrew E. author. Sitaraman, Suresh K. author. SpringerLink (Online service)
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ONLINE
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http://dx.doi.org/10.1007/978-0-387-79394-8
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10. 
Cover image for Emerging Nanotechnologies Test, Defect Tolerance, and Reliability
Emerging Nanotechnologies Test, Defect Tolerance, and Reliability
Author 
Tehranipoor, Mohammad. editor. SpringerLink (Online service)
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ONLINE
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http://dx.doi.org/10.1007/978-0-387-74747-7
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11. 
Cover image for Applications of Finite Element Methods for Reliability Studies on ULSI Interconnections
Applications of Finite Element Methods for Reliability Studies on ULSI Interconnections
Author 
Tan, Cher Ming. author. Li, Wei. author. Gan, Zhenghao. author. Hou, Yuejin. author. SpringerLink (Online service)
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ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-0-85729-310-7
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12. 
Cover image for Reliability Physics and Engineering Time-To-Failure Modeling
Reliability Physics and Engineering Time-To-Failure Modeling
Author 
McPherson, J. W. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE(332682.1)
Electronic Access 
http://dx.doi.org/10.1007/978-3-319-00122-7
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